Second International Conference on Quantum, Nano and Micro Technologies (ICQNM 2008) Preparation and Thermal Characterization of Carbon Nanotubes-Based Composites for Applications in Electronics Packaging February 10-February 15 ISBN: 978-0-7695-3085-7
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/ICQNM.2008.20
The thermal resistance of nanocomposite layers formed by Single Wall Carbon Nanotubes (SWCNT) dispersed in epoxy resins has been measured under conditions similar to the ones used to dissipate heat in microelettronic devices. Thevariation of thermal conductivity as a function of concentration of SWCNT is reported and discussed with reference to the dispersion state of SWCNT in the layers.
Index Terms:
Carbon Nanotubes, Thermal Management, Epoxy Resin, Nanocomposite, TIM, Thermal Interface Materials
Citation:
Francesco Toschi, Emanuela Tamburri, Valeria Guglielmotti, Maria Letizia Terranova, Andrea Reale, Aldo Di Carlo, Daniele Passeri, Marco Rossi, Carlo Falessi, Annamaria Fiorello, Roberta Buttiglione, "Preparation and Thermal Characterization of Carbon Nanotubes-Based Composites for Applications in Electronics Packaging," icqnm, pp.55-59, Second International Conference on Quantum, Nano and Micro Technologies (ICQNM 2008), 2008 Usage of this product signifies your acceptance of the Terms of Use. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||