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2005 International Conference on MEMS,NANO and Smart Systems
Patterning Nanometer Resist Features on Planar and Topography Substrates Using The 2-Step NERIME FIB Top Surface Imaging Process
Banff, Alberta, Canada
July 24-July 27
ISBN: 0-7695-2398-6
ASCII Text
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Khalil Arshak, Stephen F. Gilmartin, Damian Collins, Olga Korostynska, Arous Arshak, "Patterning Nanometer Resist Features on Planar and Topography Substrates Using The 2-Step NERIME FIB Top Surface Imaging Process," MEMS, NANO, and Smart Systems, International Conference on, pp. 159-166, 2005 International Conference on MEMS,NANO and Smart Systems, 2005.
 
 
BibTex
x
 
@article{ 10.1109/ICMENS.2005.97,
author = {Khalil Arshak and Stephen F. Gilmartin and Damian Collins and Olga Korostynska and Arous Arshak},
title = {Patterning Nanometer Resist Features on Planar and Topography Substrates Using The 2-Step NERIME FIB Top Surface Imaging Process},
journal ={MEMS, NANO, and Smart Systems, International Conference on},
volume = {0},
year = {2005},
isbn = {0-7695-2398-6},
pages = {159-166},
doi = {http://doi.ieeecomputersociety.org/10.1109/ICMENS.2005.97},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - CONF
JO - MEMS, NANO, and Smart Systems, International Conference on
TI - Patterning Nanometer Resist Features on Planar and Topography Substrates Using The 2-Step NERIME FIB Top Surface Imaging Process
SN - 0-7695-2398-6
SP159
EP166
A1 - Khalil Arshak,
A1 - Stephen F. Gilmartin,
A1 - Damian Collins,
A1 - Olga Korostynska,
A1 - Arous Arshak,
PY - 2005
KW - null
VL - 0
JA - MEMS, NANO, and Smart Systems, International Conference on
ER -
 
Khalil Arshak, University of Limerick, Ireland
Stephen F. Gilmartin, Analog Devices, Raheen, Limerick, Ireland
Damian Collins, Analog Devices, Raheen, Limerick, Ireland
Olga Korostynska, University of Limerick, Ireland
Arous Arshak, University of Limerick, Ireland

The 2-step negative resist image by dry etching (2-step NERIME) focused ion beam (FIB) top surface imaging (TSI) process has been previously reported as an excellent technique for patterning nanometer scale features in DNQ/novolak based photoresists on silicon substrates. In this paper we demonstrate that the 2-step NERIME process can be used to pattern nanometer scale resist features on different substrate materials and topography substrates.

Citation:
Khalil Arshak, Stephen F. Gilmartin, Damian Collins, Olga Korostynska, Arous Arshak, "Patterning Nanometer Resist Features on Planar and Topography Substrates Using The 2-Step NERIME FIB Top Surface Imaging Process," icmens, pp.159-166, 2005 International Conference on MEMS,NANO and Smart Systems, 2005
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