2005 International Conference on MEMS,NANO and Smart Systems ON THE EFFECT OF CATIONIC SURFACTANTS IN THE RINSE TO REDUCE PATTERN COLLAPSE IN HIGH ASPECT RATIO PATTERNING OF PHOTORESISTS Banff, Alberta, Canada July 24-July 27 ISBN: 0-7695-2398-6
Surface properties of photoresist lines are of particular interest in future semiconductor applications. As the critical dimension in optical lithography shrinks below 100 nm the influence of surface phenomena on the physical properties of the resist structures is growing. One serious problem in high aspect ratio patterning of photoresists is the pattern collapse. Due to the small width of the lines compared to their height, the mechanical stability of the photoresist structures decreases and may lead to collapse. The pattern collapse is known to be caused by unbalanced capillary forces between the lines during drying of the rinse liquid after wet development.
Citation:
K. Grundke, A. Drechsler, N. Petong, C. Bellmann, M. Stamm, O. Wunnicke, J Reichelt, I. M?ge, B. Pinter, T. Pearce, M. Voigt, "ON THE EFFECT OF CATIONIC SURFACTANTS IN THE RINSE TO REDUCE PATTERN COLLAPSE IN HIGH ASPECT RATIO PATTERNING OF PHOTORESISTS," icmens, pp.14-15, 2005 International Conference on MEMS,NANO and Smart Systems, 2005 Usage of this product signifies your acceptance of the Terms of Use. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||