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2004 International Conference on MEMS, NANO and Smart Systems (ICMENS'04)
Fabrications of Micro-Channel Device by Hot Emboss and Direct Bonding of PMMA
Banff, Alberta, Canada
August 25-August 27
ISBN: 0-7695-2189-4
ASCII Text
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J. Mizuno, T. Harada, T. Glinsner, M. Ishizuka, T. Edura, K. Tsutsui, H. Ishida, S. Shoji, Y. Wada, "Fabrications of Micro-Channel Device by Hot Emboss and Direct Bonding of PMMA," MEMS, NANO, and Smart Systems, International Conference on, pp. 26-29, 2004 International Conference on MEMS, NANO and Smart Systems (ICMENS'04), 2004.
 
 
BibTex
x
 
@article{ 10.1109/ICMENS.2004.66,
author = {J. Mizuno and T. Harada and T. Glinsner and M. Ishizuka and T. Edura and K. Tsutsui and H. Ishida and S. Shoji and Y. Wada},
title = {Fabrications of Micro-Channel Device by Hot Emboss and Direct Bonding of PMMA},
journal ={MEMS, NANO, and Smart Systems, International Conference on},
volume = {0},
year = {2004},
isbn = {0-7695-2189-4},
pages = {26-29},
doi = {http://doi.ieeecomputersociety.org/10.1109/ICMENS.2004.66},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - CONF
JO - MEMS, NANO, and Smart Systems, International Conference on
TI - Fabrications of Micro-Channel Device by Hot Emboss and Direct Bonding of PMMA
SN - 0-7695-2189-4
SP26
EP29
A1 - J. Mizuno,
A1 - T. Harada,
A1 - T. Glinsner,
A1 - M. Ishizuka,
A1 - T. Edura,
A1 - K. Tsutsui,
A1 - H. Ishida,
A1 - S. Shoji,
A1 - Y. Wada,
PY - 2004
KW - null
VL - 0
JA - MEMS, NANO, and Smart Systems, International Conference on
ER -
 
J. Mizuno, Waseda University
T. Harada, Waseda University
T. Glinsner, EV Group
M. Ishizuka, Waseda University
T. Edura, Waseda University
K. Tsutsui, Waseda University
H. Ishida, EV Group Japan K.K.
S. Shoji, Waseda University
Y. Wada, Waseda University
We have fabricated and evaluated the mechanical, optical and fluidic characteristics a 50µm wide and a 30µm deep micro-channel device produced by hot emboss and direct bonding of PMMA plate with dimensions of 20mm × 20mm × 1mm. The fabricated micro-channel device was evaluated the bond strength, which was confirmed to be high enough for practical use as well as for quite severe cleaning conditions as ultrasonic cleaning in pure water. The optical loss around bonded interface was also evaluated and no increase in the light absorption was observed. The above results confirmed that the hot emboss and direct bonding technologies for micro-channel manufacturing using the PMMA plates realizes high performance micro channel devices.
Citation:
J. Mizuno, T. Harada, T. Glinsner, M. Ishizuka, T. Edura, K. Tsutsui, H. Ishida, S. Shoji, Y. Wada, "Fabrications of Micro-Channel Device by Hot Emboss and Direct Bonding of PMMA," icmens, pp.26-29, 2004 International Conference on MEMS, NANO and Smart Systems (ICMENS'04), 2004
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