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2003 IEEE International Conference on Computer Design (ICCD'03)
Physical Design of the "2.5D" Stacked System
San Jose, California
October 13-October 15
ISBN: 0-7695-2025-1
ASCII Text
x 
 
Yangdong (Steven) Deng, Wojciech Maly, "Physical Design of the "2.5D" Stacked System," Computer Design, International Conference on, pp. 211, 2003 IEEE International Conference on Computer Design (ICCD'03), 2003.
 
 
BibTex
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@article{ 10.1109/ICCD.2003.1240897,
author = {Yangdong (Steven) Deng and Wojciech Maly},
title = {Physical Design of the "2.5D" Stacked System},
journal ={Computer Design, International Conference on},
volume = {0},
year = {2003},
issn = {1063-6404},
pages = {211},
doi = {http://doi.ieeecomputersociety.org/10.1109/ICCD.2003.1240897},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - CONF
JO - Computer Design, International Conference on
TI - Physical Design of the "2.5D" Stacked System
SN - 1063-6404
SP
EP
A1 - Yangdong (Steven) Deng,
A1 - Wojciech Maly,
PY - 2003
KW - null
VL - 0
JA - Computer Design, International Conference on
ER -
 
Yangdong (Steven) Deng, Carnegie Mellon University, Pittsburgh, PA
Wojciech Maly, Carnegie Mellon University, Pittsburgh, PA
Excessive on-chip wire length and fast increasing fabrication cost have been the main factors impairing the effectiveness of monolithic System-on-Chip. This paper investigates a die stacking based system integration strategy (2.5D system integration) to address these problems. The new scheme is design-tools-enabled rather than technology-driven. We developed a layout design framework, which is able to floorplan, place and route a VLSI design into stacked chips. Our results show that this new scheme has a potential to outperform its monolithic equivalent.
Citation:
Yangdong (Steven) Deng, Wojciech Maly, "Physical Design of the "2.5D" Stacked System," iccd, pp.211, 2003 IEEE International Conference on Computer Design (ICCD'03), 2003
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