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21st IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems (DFT'06)
Arlington, Virginia, USA
October 04-October 06
ISBN: 0-7695-2706-X
Lei Fang, Virginia Tech, USA
Michael S. Hsiao, Virginia Tech, USA
As the technology enters the nano dimension, the inherent unreliability of nanoelectronics is making fault-tolerant architectures increasingly necessary in building nano systems. Because fault-tolerant hardwares help to mask the effects caused by increased levels of defects, testing the functionality of the chip together with the embedded fault-tolerance becomes a tremendous challenge.

In this paper, a new bilateral testing framework for nano circuits is proposed, where multiple stuck-at faults across different modules in a triple module redundancy (TMR) architecture are considered. In addition, a new test generator is presented for the bilateral testing that takes into account the enormous number of bilateral stuck-at faults possible with new types of guidance in the search, and it can generate a set of vectors that can test the TMR-based nano circuit as a single entity. Experimental results reported for ISCAS?85 and ITC99 circuits demonstrate that the bilateral testing can help to capture many more defects which the single stuck-at fault misses.

Citation:
Lei Fang, Michael S. Hsiao, "Bilateral Testing of Nano-scale Fault-tolerant Circuits," dft, pp.309-317, 21st IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems (DFT'06), 2006
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