Modern semiconductor process technologies enable the manufacturing of a complete system on one single die, the so-called system-on-chip or SOC. Building those chips in a timely and cost-effective manner is amongst others realized by embedding third-party IP cores. Due to imperfections in silicon manufacturing, an SOC including all its embedded modules needs to be tested for manufacturing defects.
Citation:
Tom Waayers, Erik Jan Marinissen, Maurice Lousberg, "IEEE Std 1500 Compliant Infrastructure forModular SOC Testing," ats, pp.450, 14th Asian Test Symposium (ATS'05), 2005