2007 Asia and South Pacific Design Automation Conference
Configurable Multi-Processor Platforms for Next Generation Embedded Systems
Yokohama
January 23-January 26
ISBN: 1-4244-0629-3
David Goodwin, Tensilica Inc., Santa Clara CA 95054. Tel: +1-123-456-7890, Fax: +1-408-986-8919, e-mail: goodwin@te
Chris Rowen, Tensilica Inc., Santa Clara CA 95054. Tel: +1-408-327-7333, Fax: +1-408-986-8919, e-mail: rowen@tens
Grant Martin, Tensilica Inc., Santa Clara CA 95054. Tel: +1-408-327-7323, Fax: +1-408-986-8919, e-mail: gmartin@te
Next-generation embedded systems in application domains such as multimedia, wired and wireless communications, and multipurpose portable devices, are increasingly turning to multiprocessor platforms as a vehicle for their realization. But entirely fixed platforms composed of entirely fixed components lack the flexibility and ability to be optimized to the application to offer the best solution in any of these areas. Configurability at multiple levels offers a much better chance to optimize the resulting multiprocessor platform. Existing and emerging technologies for configurable and extensible processors and the creation of configurable multiprocessor subsystem platforms offer significant capability to design teams to both differentiate and optimize their products.
Citation:
David Goodwin, Chris Rowen, Grant Martin, "Configurable Multi-Processor Platforms for Next Generation Embedded Systems," asp-dac, pp.744-746, 2007 Asia and South Pacific Design Automation Conference, 2007