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2007 Asia and South Pacific Design Automation Conference
Recent Research and Emerging Challenges in Physical Design for Manufacturability/Reliability
Yokohama
January 23-January 26
ISBN: 1-4244-0629-3
ASCII Text
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Chung-Wei Lin, Ming-Chao Tsai, Kuang-Yao Lee, Tai-Chen Chen, Ting-Chi Wang, Yao-Wen Chang, "Recent Research and Emerging Challenges in Physical Design for Manufacturability/Reliability," Asia and South Pacific Design Automation Conference, pp. 238-243, 2007 Asia and South Pacific Design Automation Conference, 2007.
 
 
BibTex
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@article{ 10.1109/ASPDAC.2007.357992,
author = {Chung-Wei Lin and Ming-Chao Tsai and Kuang-Yao Lee and Tai-Chen Chen and Ting-Chi Wang and Yao-Wen Chang},
title = {Recent Research and Emerging Challenges in Physical Design for Manufacturability/Reliability},
journal ={Asia and South Pacific Design Automation Conference},
volume = {0},
year = {2007},
isbn = {1-4244-0629-3},
pages = {238-243},
doi = {http://doi.ieeecomputersociety.org/10.1109/ASPDAC.2007.357992},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
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TY - CONF
JO - Asia and South Pacific Design Automation Conference
TI - Recent Research and Emerging Challenges in Physical Design for Manufacturability/Reliability
SN - 1-4244-0629-3
SP238
EP243
A1 - Chung-Wei Lin,
A1 - Ming-Chao Tsai,
A1 - Kuang-Yao Lee,
A1 - Tai-Chen Chen,
A1 - Ting-Chi Wang,
A1 - Yao-Wen Chang,
PY - 2007
KW - null
VL - 0
JA - Asia and South Pacific Design Automation Conference
ER -
 
Chung-Wei Lin, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei 106, Taiwan. enorm
Ming-Chao Tsai, Department of Computer Science, National Tsing Hua University, Hsinchu 300, Taiwan. enorm@eda.ee.ntu
Kuang-Yao Lee, Department of Computer Science, National Tsing Hua University, Hsinchu 300, Taiwan. enorm@eda.ee.ntu
Tai-Chen Chen, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei 106, Taiwan. tcche
Ting-Chi Wang, Department of Computer Science, National Tsing Hua University, Hsinchu 300, Taiwan. enorm@eda.ee.ntu
Yao-Wen Chang, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei 106, Taiwan; Depar
As IC process geometries scale down to the nanometer territory, the industry faces severe challenges of manufacturing limitations. To guarantee yield and reliability, physical design for manufacturability and reliability has played a pivotal role in resolution and thus yield enhancement for the imperfect manufacturing process. In this paper, we introduce major challenges arising from nanometer process technology, survey key existing techniques for handling the challenges, and provide some future research directions in physical design for manufacturability and reliability.
Citation:
Chung-Wei Lin, Ming-Chao Tsai, Kuang-Yao Lee, Tai-Chen Chen, Ting-Chi Wang, Yao-Wen Chang, "Recent Research and Emerging Challenges in Physical Design for Manufacturability/Reliability," asp-dac, pp.238-243, 2007 Asia and South Pacific Design Automation Conference, 2007
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