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2007 Asia and South Pacific Design Automation Conference
A Multi-Drop Transmission-Line Interconnect in Si LSI
Yokohama
January 23-January 26
ISBN: 1-4244-0629-3
ASCII Text
x 
 
Junki Seita, Hiroyuki Ito, Kenichi Okada, Takashi Sato, Kazuya Masu, "A Multi-Drop Transmission-Line Interconnect in Si LSI," Asia and South Pacific Design Automation Conference, pp. 118-119, 2007 Asia and South Pacific Design Automation Conference, 2007.
 
 
BibTex
x
 
@article{ 10.1109/ASPDAC.2007.357969,
author = {Junki Seita and Hiroyuki Ito and Kenichi Okada and Takashi Sato and Kazuya Masu},
title = {A Multi-Drop Transmission-Line Interconnect in Si LSI},
journal ={Asia and South Pacific Design Automation Conference},
volume = {0},
year = {2007},
isbn = {1-4244-0629-3},
pages = {118-119},
doi = {http://doi.ieeecomputersociety.org/10.1109/ASPDAC.2007.357969},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - CONF
JO - Asia and South Pacific Design Automation Conference
TI - A Multi-Drop Transmission-Line Interconnect in Si LSI
SN - 1-4244-0629-3
SP118
EP119
A1 - Junki Seita,
A1 - Hiroyuki Ito,
A1 - Kenichi Okada,
A1 - Takashi Sato,
A1 - Kazuya Masu,
PY - 2007
KW - null
VL - 0
JA - Asia and South Pacific Design Automation Conference
ER -
 
Junki Seita, Integrated Research Institute, Tokyo Institute of Technology, 4259-R2-17 Nagatsuta, Midori-ku, Yokoh
Hiroyuki Ito, Integrated Research Institute, Tokyo Institute of Technology, 4259-R2-17 Nagatsuta, Midori-ku, Yokoh
Kenichi Okada, Integrated Research Institute, Tokyo Institute of Technology, 4259-R2-17 Nagatsuta, Midori-ku, Yokoh
Takashi Sato, Integrated Research Institute, Tokyo Institute of Technology, 4259-R2-17 Nagatsuta, Midori-ku, Yokoh
Kazuya Masu, Integrated Research Institute, Tokyo Institute of Technology, 4259-R2-17 Nagatsuta, Midori-ku, Yokoh
This paper proposes a branching method for on-chip transmission line (TL) interconnects, which can reduce delay and power of global interconnects. A 6-mm-long TL interconnect with a branch is fabricated by using a 0.18?m standard Si CMOS process, and the measurement result performs 4 Gbps signal transmission.
Citation:
Junki Seita, Hiroyuki Ito, Kenichi Okada, Takashi Sato, Kazuya Masu, "A Multi-Drop Transmission-Line Interconnect in Si LSI," asp-dac, pp.118-119, 2007 Asia and South Pacific Design Automation Conference, 2007
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