Wolfgang Windl, Matthew Laudon, Neil N. Carlson, Murray S. Daw, "Predictive Process Simulation and Stress-Mediated Diffusion in Silicon," Computing in Science and Engineering, vol. 3, no. 4, pp. 92-95, July/August, 2001.

@article{ 10.1109/5992.931909,
author = {Wolfgang Windl and Matthew Laudon and Neil N. Carlson and Murray S. Daw},
title = {Predictive Process Simulation and Stress-Mediated Diffusion in Silicon},
journal ={Computing in Science and Engineering},
volume = {3},
number = {4},
issn = {1521-9615},
year = {2001},
pages = {92-95},
doi = {http://doi.ieeecomputersociety.org/10.1109/5992.931909},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}

TY - MGZN
JO - Computing in Science and Engineering
TI - Predictive Process Simulation and Stress-Mediated Diffusion in Silicon
IS - 4
SN - 1521-9615
SP92
EP95
EPD - 92-95
A1 - Wolfgang Windl,
A1 - Matthew Laudon,
A1 - Neil N. Carlson,
A1 - Murray S. Daw,
PY - 2001
VL - 3
JA - Computing in Science and Engineering
ER -