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Image Processing Techniques for Wafer Defect Cluster Identification
March/April 2002 (vol. 19 no. 2)
pp. 44-48
ASCII Text
x 
 
Chenn-Jung Huang, Chua-Chin Wang, Chi-Feng Wu, "Image Processing Techniques for Wafer Defect Cluster Identification," IEEE Design and Test of Computers, vol. 19, no. 2, pp. 44-48, March/April, 2002.
 
 
BibTex
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@article{ 10.1109/54.990441,
author = {Chenn-Jung Huang and Chua-Chin Wang and Chi-Feng Wu},
title = {Image Processing Techniques for Wafer Defect Cluster Identification},
journal ={IEEE Design and Test of Computers},
volume = {19},
number = {2},
issn = {0740-7475},
year = {2002},
pages = {44-48},
doi = {http://doi.ieeecomputersociety.org/10.1109/54.990441},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - MGZN
JO - IEEE Design and Test of Computers
TI - Image Processing Techniques for Wafer Defect Cluster Identification
IS - 2
SN - 0740-7475
SP44
EP48
EPD - 44-48
A1 - Chenn-Jung Huang,
A1 - Chua-Chin Wang,
A1 - Chi-Feng Wu,
PY - 2002
VL - 19
JA - IEEE Design and Test of Computers
ER -
 

An automatic, wafer-scale, defect cluster identifier finds and marks all defective dies, further automating wafer testing. A prototype tool screens 45,000 wafers, saving a Philips Semiconductor test facility $100,000 in expenses per month.

Citation:
Chenn-Jung Huang, Chua-Chin Wang, Chi-Feng Wu, "Image Processing Techniques for Wafer Defect Cluster Identification," IEEE Design and Test of Computers, vol. 19, no. 2, pp. 44-48, Mar./Apr. 2002, doi:10.1109/54.990441
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