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Using Atomic Force Microscopy for Deep-Submicron Failure Analysis
January/February 2001 (vol. 18 no. 1)
pp. 10-18
ASCII Text
x 
 
Jien-Chung Lo, William D. Armitage, Corbet S. Johnson, "Using Atomic Force Microscopy for Deep-Submicron Failure Analysis," IEEE Design and Test of Computers, vol. 18, no. 1, pp. 10-18, January/February, 2001.
 
 
BibTex
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@article{ 10.1109/54.902818,
author = {Jien-Chung Lo and William D. Armitage and Corbet S. Johnson},
title = {Using Atomic Force Microscopy for Deep-Submicron Failure Analysis},
journal ={IEEE Design and Test of Computers},
volume = {18},
number = {1},
issn = {0740-7475},
year = {2001},
pages = {10-18},
doi = {http://doi.ieeecomputersociety.org/10.1109/54.902818},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - MGZN
JO - IEEE Design and Test of Computers
TI - Using Atomic Force Microscopy for Deep-Submicron Failure Analysis
IS - 1
SN - 0740-7475
SP10
EP18
EPD - 10-18
A1 - Jien-Chung Lo,
A1 - William D. Armitage,
A1 - Corbet S. Johnson,
PY - 2001
VL - 18
JA - IEEE Design and Test of Computers
ER -
 
As circuit feature size continues to shrink, we will soon need a failure analysis technique that provides resolutions of 10 nanometers or less. This feasibility study concludes that AFM technology, with reasonable improvements, can take over where focused ion beams leave off.
Citation:
Jien-Chung Lo, William D. Armitage, Corbet S. Johnson, "Using Atomic Force Microscopy for Deep-Submicron Failure Analysis," IEEE Design and Test of Computers, vol. 18, no. 1, pp. 10-18, Jan./Feb. 2001, doi:10.1109/54.902818
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