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Thermal Testing on Reconfigurable Computers
January-March 2000 (vol. 17 no. 1)
pp. 84-91
ASCII Text
x 
 
Sergio Lopez-Buedo, Javier Garrido, Eduardo Boemo, "Thermal Testing on Reconfigurable Computers," IEEE Design and Test of Computers, vol. 17, no. 1, pp. 84-91, January-March, 2000.
 
 
BibTex
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@article{ 10.1109/54.825679,
author = {Sergio Lopez-Buedo and Javier Garrido and Eduardo Boemo},
title = {Thermal Testing on Reconfigurable Computers},
journal ={IEEE Design and Test of Computers},
volume = {17},
number = {1},
issn = {0740-7475},
year = {2000},
pages = {84-91},
doi = {http://doi.ieeecomputersociety.org/10.1109/54.825679},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - MGZN
JO - IEEE Design and Test of Computers
TI - Thermal Testing on Reconfigurable Computers
IS - 1
SN - 0740-7475
SP84
EP91
EPD - 84-91
A1 - Sergio Lopez-Buedo,
A1 - Javier Garrido,
A1 - Eduardo Boemo,
PY - 2000
VL - 17
JA - IEEE Design and Test of Computers
ER -
 

Ring-oscillators are useful to monitor the thermal status of reconfigurable computers. No analog parts exist, and the sensors can be dynamically inserted, moved, or eliminated.

Citation:
Sergio Lopez-Buedo, Javier Garrido, Eduardo Boemo, "Thermal Testing on Reconfigurable Computers," IEEE Design and Test of Computers, vol. 17, no. 1, pp. 84-91, Jan.-Mar. 2000, doi:10.1109/54.825679
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