This article presents a design flow for integrated microelectromechanical systems (MEMS), with particular focus on electromechanical single-chip devices. The flow includes steps for both sensor and circuit design, and also addresses the issues of sensor-circuit interaction. The importance of packaging in a MEMS design flow is covered. Three practical examples based on inertial-sensor technology illustrate several steps in the flow, namely the mechanical schematic, the layout simulation, and package interaction. In the case of package interaction, experimental results are presented.