Sensitivity Analysis of Critical Parameters in Board Test

Design&Test
1996
Issue No. 1 - Spring
Abstract - Sensitivity Analysis of Critical Parameters in Board Test

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	Similar Articles Articles by Mick M.v. Tegethoff Articles by Tom W. Chen

Spring 1996 (vol. 13 no. 1)

pp. 58-63

	ASCII Text	x
	Mick M.v. Tegethoff, Tom W. Chen, "Sensitivity Analysis of Critical Parameters in Board Test," IEEE Design and Test of Computers, vol. 13, no. 1, pp. 58-63, Spring, 1996.

	BibTex	x
	@article{ 10.1109/54.485783, author = {Mick M.v. Tegethoff and Tom W. Chen}, title = {Sensitivity Analysis of Critical Parameters in Board Test}, journal ={IEEE Design and Test of Computers}, volume = {13}, number = {1}, issn = {0740-7475}, year = {1996}, pages = {58-63}, doi = {http://doi.ieeecomputersociety.org/10.1109/54.485783}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Design and Test of Computers TI - Sensitivity Analysis of Critical Parameters in Board Test IS - 1 SN - 0740-7475 SP58 EP63 EPD - 58-63 A1 - Mick M.v. Tegethoff, A1 - Tom W. Chen, PY - 1996 KW - test costs KW - board faults KW - dft KW - board test coverage KW - yield VL - 13 JA - IEEE Design and Test of Computers ER -

Mick M.v. Tegethoff

Tom W. Chen

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/54.485783

An analysis of the main contributors to the quality and cost of complex board manufacturing is presented. Manufacturing data from three boards built at Hewlett-Packard and simulation models are used to derive the sensitivity of quality and cost versus Surface Mount Technology (SMT) solder defect rate, component functional defect rate and test coverage. A new Yield model which accounts for the clustering of solder defects is introduced, and a first-order estimation of the cost of implementing the IEEE 1149.1 standard on ASICs is given.

Index Terms:

test costs , board faults, dft , board test coverage, yield

Citation:

Mick M.v. Tegethoff, Tom W. Chen, "Sensitivity Analysis of Critical Parameters in Board Test," IEEE Design and Test of Computers, vol. 13, no. 1, pp. 58-63, Mar. 1996, doi:10.1109/54.485783

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