Failure Analysis of High-Density CMOS SRAMs: Using Realistic Defect Modeling and I/Sub DDQ/ Testing

Design&Test
1993
Issue No. 2 - April/June
Abstract - Failure Analysis of High-Density CMOS SRAMs: Using Realistic Defect Modeling and I/Sub DDQ/ Testing

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April/June 1993 (vol. 10 no. 2)

pp. 13-23

	ASCII Text	x
	Samir Naik, Frank Agricola, Wojciech Maly, "Failure Analysis of High-Density CMOS SRAMs: Using Realistic Defect Modeling and I/Sub DDQ/ Testing," IEEE Design and Test of Computers, vol. 10, no. 2, pp. 13-23, April/June, 1993.

	BibTex	x
	@article{ 10.1109/54.211524, author = {Samir Naik and Frank Agricola and Wojciech Maly}, title = {Failure Analysis of High-Density CMOS SRAMs: Using Realistic Defect Modeling and I/Sub DDQ/ Testing}, journal ={IEEE Design and Test of Computers}, volume = {10}, number = {2}, issn = {0740-7475}, year = {1993}, pages = {13-23}, doi = {http://doi.ieeecomputersociety.org/10.1109/54.211524}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Design and Test of Computers TI - Failure Analysis of High-Density CMOS SRAMs: Using Realistic Defect Modeling and I/Sub DDQ/ Testing IS - 2 SN - 0740-7475 SP13 EP23 EPD - 13-23 A1 - Samir Naik, A1 - Frank Agricola, A1 - Wojciech Maly, PY - 1993 VL - 10 JA - IEEE Design and Test of Computers ER -

Samir Naik

Frank Agricola

Wojciech Maly

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/54.211524

A rapid failure analysis method for high-density CMOS static RAMs (SRAMs) that uses realistic defect modeling and the results of functional and I/sub DDQ/ testing is presented. The key to the method is the development of a defect-to-signature vocabulary through inductive fault analysis. Results indicate that the method can efficiently debug the multimegabit-memory manufacturing process.

Citation:

Samir Naik, Frank Agricola, Wojciech Maly, "Failure Analysis of High-Density CMOS SRAMs: Using Realistic Defect Modeling and I/Sub DDQ/ Testing," IEEE Design and Test of Computers, vol. 10, no. 2, pp. 13-23, Apr. 1993, doi:10.1109/54.211524

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