By measuring the temperature at some points of an IC during a test procedure, defects can be detected (fault testing). With a simple processing of the measured temperature waveform, the distance between the temperature monitoring point and the activated defect can be derived. This paper presents four temperature-measuring strategies to determine this distance for diagnosis purposes.
Index Terms:
Thermal Testing, Temperature Measurements, Built-In Differential Temperature Sensors, Fault Location, Mixed-Signal Circuits
Citation:
J. Altet, A. Rubio, E. Schaub, S. Dialhaire, W. Claeys, "Thermal Testing: Fault Location Strategies," vts, pp.189, 18th IEEE VLSI Test Symposium (VTS'00), 2000