2.2 Signal Integrity Problems in Deep Submicron Arising from Interconnects between Cores
Monterey, California
April 26-April 30
ISBN: 0-8186-8436-4
ASCII Text
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P. Nordholz, D. Treytnar, J. Otterstedt, H. Grabinski, D. Niggemeyer, T.W. Williams,
"2.2 Signal Integrity Problems in Deep Submicron Arising from Interconnects between Cores,"
VLSI Test Symposium, IEEE, pp. 28, 16th IEEE VLSI Test Symposium, 1998.
BibTex
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@article{
10.1109/VTEST.1998.670845, author = {P. Nordholz and D. Treytnar and J. Otterstedt and H. Grabinski and D. Niggemeyer and T.W. Williams}, title = {2.2 Signal Integrity Problems in Deep Submicron Arising from Interconnects between Cores}, journal ={VLSI Test Symposium, IEEE}, volume = {0}, year = {1998}, issn = {1093-0167}, pages = {28}, doi = {http://doi.ieeecomputersociety.org/10.1109/VTEST.1998.670845}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }
RefWorks Procite/RefMan/Endnote
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TY - CONF JO - VLSI Test Symposium, IEEE TI - 2.2 Signal Integrity Problems in Deep Submicron Arising from Interconnects between Cores SN - 1093-0167 SP EP A1 - P. Nordholz, A1 - D. Treytnar, A1 - J. Otterstedt, A1 - H. Grabinski, A1 - D. Niggemeyer, A1 - T.W. Williams, PY - 1998 VL - 0 JA - VLSI Test Symposium, IEEE ER -
P. Nordholz, D. Treytnar, J. Otterstedt, H. Grabinski, D. Niggemeyer, T.W. Williams, "2.2 Signal Integrity Problems in Deep Submicron Arising from Interconnects between Cores," vts, pp.28, 16th IEEE VLSI Test Symposium, 1998
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