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16th International Conference on VLSI Design
Immediate Neighbor Difference IDDQ Test (INDIT) for Outlier Identification
New Delhi, India
January 04-January 08
ISBN: 0-7695-1868-0
Sagar S. Sabade, Texas A&M University
D. M. H. Walker, Texas A&M University
Increasing magnitude and variation in leakage current make it impossible to distinguish between faulty and fault-free chips using single threshold method. Neighboring chips on a wafer have similar fault-free properties. By obtaining differences in IDDQ values it is possible to discriminate faulty dice. In this paper we describe a methodology in which comparison of IDDQ of a die with that of its neighboring dice on the wafer is evaluated for screening faulty chips at the wafer level. The analysis based on the SEMATECH test data? is presented.
Index Terms:
Keywords: I<sub>DDQ</sub> testing, delta I<sub>DDQ</sub>, spatial correlation
Citation:
Sagar S. Sabade, D. M. H. Walker, "Immediate Neighbor Difference IDDQ Test (INDIT) for Outlier Identification," vlsid, pp.361, 16th International Conference on VLSI Design, 2003
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