Sandeep K. Shukla, Jean Pierre Talpin, Stephen A. Edwards, Rajesh K. Gupta, "High Level Modeling and Validation Methodologies for Embedded Systems: Bridging the Productivity Gap," VLSI Design, International Conference on, pp. 9, 16th International Conference on VLSI Design, 2003.

@article{ 10.1109/ICVD.2003.1183104,
author = {Sandeep K. Shukla and Jean Pierre Talpin and Stephen A. Edwards and Rajesh K. Gupta},
title = {High Level Modeling and Validation Methodologies for Embedded Systems: Bridging the Productivity Gap},
journal ={VLSI Design, International Conference on},
volume = {0},
year = {2003},
issn = {1063-9667},
pages = {9},
doi = {http://doi.ieeecomputersociety.org/10.1109/ICVD.2003.1183104},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}

TY - CONF
JO - VLSI Design, International Conference on
TI - High Level Modeling and Validation Methodologies for Embedded Systems: Bridging the Productivity Gap
SN - 1063-9667
SP
EP
A1 - Sandeep K. Shukla,
A1 - Jean Pierre Talpin,
A1 - Stephen A. Edwards,
A1 - Rajesh K. Gupta,
PY - 2003
KW - null
VL - 0
JA - VLSI Design, International Conference on
ER -