loading...
 This Article 
   
 Share 
   
 Bibliographic References 
   
 Add to: 
 
Digg
Furl
Spurl
Blink
Simpy
Google
Del.icio.us
Y!MyWeb
 
 Search 
   
13th IEEE International Workshop on Rapid System Prototyping (RSP'02)
Prototyping Ethernet in the First Mile over Point-to-Point Copper
Darmstadt, Germany
July 01-July 03
ISBN: 0-7695-1703-X
Eric Borghs, Alcatel Research & Innovation
Jeroen Jacobs, Alcatel Research & Innovation
Michaël Beck, Alcatel Research & Innovation
Adrian Mihanta, Alcatel Research & Innovation
Piet Vandaele, Alcatel Research & Innovation
Thierry Pollet, Alcatel Research & Innovation
Ethernet in the First Mile (EFM) over the point-to-point copper subscriber access network is being standardised in the IEEE 802.3ah Task Force. An overview is given of the functional layer model that uses the VDSL physical layer, which fulfils the EFM objectives. The layers under definition (PTM-TC & EoVDSL-AL) are described together with possible scenarios for the problems to be resolved. To enable exploration of different solutions on the level of standardisation, system architecture and implementation, a flexible prototype is developed, that will provide proof of concept. It is built around an FPGA that has a scalable architecture and is easy adaptable because of its modularity, and delivers re-usable building blocks, either for ASIC integration or for a low-cost FPGA.
Citation:
Eric Borghs, Jeroen Jacobs, Michaël Beck, Adrian Mihanta, Piet Vandaele, Thierry Pollet, "Prototyping Ethernet in the First Mile over Point-to-Point Copper," rsp, pp.53, 13th IEEE International Workshop on Rapid System Prototyping (RSP'02), 2002
Usage of this product signifies your acceptance of the Terms of Use.