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International Test Conference 2003 (ITC'03)
FPGA Interconnect Delay Fault Testing
Charlotte, NC, USA
September 30-October 02
ISBN: 0-7803-8107-6
Erik Chmelar, Stanford University
Interconnection networks consume the majority of die area in an FPGA. Presented is a scalable manufacturing test method for all SRAM-based FPGAs, able to detect multiple interconnect delay faults, multiple bridging faults, or both. An adjustable maximum sensitivity to resistive open defects of several kilo-ohms is achieved. Bridging faults that cause a signal transition to occur one at least one of the bridged interconnects are detectable. Finally, fast and simple fault localization is presented.
Citation:
Erik Chmelar, "FPGA Interconnect Delay Fault Testing," itc, pp.1239, International Test Conference 2003 (ITC'03), 2003
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