Impact of Multiple-Detect Test Patterns on Product Quality

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International Test Conference 2003 (ITC'03)

Charlotte, NC, USA

September 30-October 02

ISBN: 0-7803-8107-6

	ASCII Text	x
	Brady Benware, Chris Schuermyer, Sreenevasan Ranganathan, Robert Madge, Prabhu Krishnamurthy, Nagesh Tamarapalli, Kun-Han Tsai, Janusz Rajski, "Impact of Multiple-Detect Test Patterns on Product Quality," Test Conference, International, pp. 1031, International Test Conference 2003 (ITC'03), 2003.

	BibTex	x
	@article{ 10.1109/TEST.2003.1271091, author = {Brady Benware and Chris Schuermyer and Sreenevasan Ranganathan and Robert Madge and Prabhu Krishnamurthy and Nagesh Tamarapalli and Kun-Han Tsai and Janusz Rajski}, title = {Impact of Multiple-Detect Test Patterns on Product Quality}, journal ={Test Conference, International}, volume = {0}, year = {2003}, issn = {1089-3539}, pages = {1031}, doi = {http://doi.ieeecomputersociety.org/10.1109/TEST.2003.1271091}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - CONF JO - Test Conference, International TI - Impact of Multiple-Detect Test Patterns on Product Quality SN - 1089-3539 SP EP A1 - Brady Benware, A1 - Chris Schuermyer, A1 - Sreenevasan Ranganathan, A1 - Robert Madge, A1 - Prabhu Krishnamurthy, A1 - Nagesh Tamarapalli, A1 - Kun-Han Tsai, A1 - Janusz Rajski, PY - 2003 KW - null VL - 0 JA - Test Conference, International ER -

Brady Benware, LSI Logic Corporation, Gresham, OR

Chris Schuermyer, LSI Logic Corporation, Gresham, OR

Sreenevasan Ranganathan, LSI Logic Corporation, Gresham, OR

Robert Madge, LSI Logic Corporation, Gresham, OR

Prabhu Krishnamurthy, LSI Logic Corporation, Gresham, OR

Nagesh Tamarapalli, Mentor Graphics Corporation, Wilsonville, OR

Kun-Han Tsai, Mentor Graphics Corporation, Wilsonville, OR

Janusz Rajski, Mentor Graphics Corporation, Wilsonville, OR

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/TEST.2003.1271091

This paper presents the impact of multiple-detect test patterns on outgoing product quality. It introduces an ATPG tool that generates multiple-detect test patterns while maximizing the coverage of node-to-node bridging defects. Volume data obtained by testing a production ASIC with these new multiple-detect patterns shows increased defect screening capability and very good agreement with the bridging coverage estimated by the ATPG tool.

Citation:

Brady Benware, Chris Schuermyer, Sreenevasan Ranganathan, Robert Madge, Prabhu Krishnamurthy, Nagesh Tamarapalli, Kun-Han Tsai, Janusz Rajski, "Impact of Multiple-Detect Test Patterns on Product Quality," itc, pp.1031, International Test Conference 2003 (ITC'03), 2003

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