MEMS Fabrication

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International Test Conference 2003 (ITC'03)

MEMS Fabrication

Charlotte, NC, USA

September 30-October 02

ISBN: 0-7803-8107-6

	ASCII Text	x
	Gary K. Fedder, "MEMS Fabrication," Test Conference, International, pp. 691, International Test Conference 2003 (ITC'03), 2003.

	BibTex	x
	@article{ 10.1109/TEST.2003.1270898, author = {Gary K. Fedder}, title = {MEMS Fabrication}, journal ={Test Conference, International}, volume = {0}, year = {2003}, issn = {1089-3539}, pages = {691}, doi = {http://doi.ieeecomputersociety.org/10.1109/TEST.2003.1270898}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - CONF JO - Test Conference, International TI - MEMS Fabrication SN - 1089-3539 SP EP A1 - Gary K. Fedder, PY - 2003 KW - null VL - 0 JA - Test Conference, International ER -

Gary K. Fedder, Carnegie Mellon University, Pittsburgh, PA

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/TEST.2003.1270898

This summary of selected microelectromechanical systems (MEMS) processes guides the reader through a wide variety of fabrication techniques used to make micromechanical structures. Process flows include wet bulk etching and wafer bonding, surface micromachining, deep trench silicon micromachining, CMOS MEMS, and micromolding.

Citation:

Gary K. Fedder, "MEMS Fabrication," itc, pp.691, International Test Conference 2003 (ITC'03), 2003

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