Burn-in Temperature Projections for Deep Sub-micron Technologies

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International Test Conference 2003 (ITC'03)

Charlotte, NC, USA

September 30-October 02

ISBN: 0-7803-8107-6

	ASCII Text	x
	Oleg Semenov, Arman Vassighi, Manoj Sachdev, Ali Keshavarzi, C.F. Hawkins, "Burn-in Temperature Projections for Deep Sub-micron Technologies," Test Conference, International, pp. 95, International Test Conference 2003 (ITC'03), 2003.

	BibTex	x
	@article{ 10.1109/TEST.2003.1270829, author = {Oleg Semenov and Arman Vassighi and Manoj Sachdev and Ali Keshavarzi and C.F. Hawkins}, title = {Burn-in Temperature Projections for Deep Sub-micron Technologies}, journal ={Test Conference, International}, volume = {0}, year = {2003}, issn = {1089-3539}, pages = {95}, doi = {http://doi.ieeecomputersociety.org/10.1109/TEST.2003.1270829}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - CONF JO - Test Conference, International TI - Burn-in Temperature Projections for Deep Sub-micron Technologies SN - 1089-3539 SP EP A1 - Oleg Semenov, A1 - Arman Vassighi, A1 - Manoj Sachdev, A1 - Ali Keshavarzi, A1 - C.F. Hawkins, PY - 2003 KW - null VL - 0 JA - Test Conference, International ER -

Oleg Semenov, University of Waterloo, Canada

Arman Vassighi, University of Waterloo, Canada

Manoj Sachdev, University of Waterloo, Canada

Ali Keshavarzi, Intel Corporation, Hillsboro, OR

C.F. Hawkins, University of New Mexico, Albuquerque

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/TEST.2003.1270829

Burn-in faces significant challenges in recent CMOS technologies. The self-generated heat of each IC in a burn-in environment contributes to larger currents that can lead to further increase in junction temperatures, possible thermal run away, and yield-loss of good parts. Calculations show that the junction temperature is increasing by 1.45X/generation. This paper estimates the increase in junction temperature with scaling and discusses the optimal burn-in temperature with scaling. Our research indicates that the burn-in temperature must also be reduced with technology scaling. The impact on commercial burn-in ovens is also described.

Citation:

Oleg Semenov, Arman Vassighi, Manoj Sachdev, Ali Keshavarzi, C.F. Hawkins, "Burn-in Temperature Projections for Deep Sub-micron Technologies," itc, pp.95, International Test Conference 2003 (ITC'03), 2003

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