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International Test Conference 2002 (ITC'02)
Wafer/Package Test Mix for Optimal Defect Detection
Baltimore, MD, USA
October 07-October 10
ISBN: 0-7803-7543-2
ASCII Text
x 
 
Peter C. Maxwell, "Wafer/Package Test Mix for Optimal Defect Detection," Test Conference, International, pp. 1050, International Test Conference 2002 (ITC'02), 2002.
 
 
BibTex
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@article{ 10.1109/TEST.2002.1041861,
author = {Peter C. Maxwell},
title = {Wafer/Package Test Mix for Optimal Defect Detection},
journal ={Test Conference, International},
volume = {0},
year = {2002},
isbn = {0-7803-7543-2},
pages = {1050},
doi = {http://doi.ieeecomputersociety.org/10.1109/TEST.2002.1041861},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - CONF
JO - Test Conference, International
TI - Wafer/Package Test Mix for Optimal Defect Detection
SN - 0-7803-7543-2
SP
EP
A1 - Peter C. Maxwell,
PY - 2002
KW - null
VL - 0
JA - Test Conference, International
ER -
 
Peter C. Maxwell, Agilent Technologies
This paper presents the results of an extensive data collection study where production wafer and package test data are examined from the point of view of determining an optimal mix of wafer and package tests to achieve the combined goals of high defect coverage and rapid yield learning, while simultaneously examining the possibility of using lower cost ATE. Results for at-speed tests show that for some types of parts reduced speed transition fault testing can be very effective.
Citation:
Peter C. Maxwell, "Wafer/Package Test Mix for Optimal Defect Detection," itc, pp.1050, International Test Conference 2002 (ITC'02), 2002
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