loading...
 This Article 
   
 Share 
   
 Bibliographic References 
   
 Add to: 
 
Digg
Furl
Spurl
Blink
Simpy
Google
Del.icio.us
Y!MyWeb
 
 Search 
   
International Test Conference 2002 (ITC'02)
Low-Contact-Force Probing on Copper Electrodes
Baltimore, MD, USA
October 07-October 10
ISBN: 0-7803-7543-2
Kenichi Kataoka, University of Tokyo
Toshihiro Itoh, University of Tokyo
Katsuya Okumura, University of Tokyo
Tadatomo Suga, University of Tokyo
A contact method between IC pads and probes at low contact force is a key to develop a probe card with over ten thousand probes and MEMS probe cards. In this paper, we have investigated the characteristics of new low-force contact methods on Cu electrodes in addition to Al electrodes. One method is to use an electric breakdown by applying voltage to the electrodes, and another one is to deoxidize the native oxide on the surface of Cu electrode before probing. A conventional needle probe card of tungsten probes were used for the experiment. At contact force of 1 mN, contact resistances of less than 2 Ω were obtained by the deoxidization process, and 0.7 Ω were obtained in combination of both the oxidization and the electric breakdown by applying 10 V.
Citation:
Kenichi Kataoka, Toshihiro Itoh, Katsuya Okumura, Tadatomo Suga, "Low-Contact-Force Probing on Copper Electrodes," itc, pp.424, International Test Conference 2002 (ITC'02), 2002
Usage of this product signifies your acceptance of the Terms of Use.