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International Test Conference 2002 (ITC'02)
DFT Techniques for Wafer-Level At-Speed Testing of High-Speed SRAMs
Baltimore, MD, USA
October 07-October 10
ISBN: 0-7803-7543-2
O. Hirabayashi, Toshiba Corporation
A. Suzuki, Toshiba Corporation
T. Yabe, Toshiba Corporation
A. Kawasumi, Toshiba Corporation
Y. Takeyama, Toshiba Corporation
K. Kushida, Toshiba Corporation
A. Tohata, Toshiba Microelectronics Corporation
N. Otsuka, Toshiba Corporation
Design-For-Test (DFT) techniques for acquiring fail bit map of at-speed function with conventional wafer test equipment are proposed. SRAM core is operated with high-frequency clock generated by gain-suppressed VCO which can reduce clock jitter. The data are output with data out strobe control circuit synchronizing with external low-frequency clock. Using these techniques, the SRAM chip appears to be operated with low-frequency tester clock while SRAM core is operated with high-frequency internal clock. Therefore, fail bit map of high-frequency operation can be obtained with conventional wafer test equipment. The at-speed test with fail bit map acquisition allows slow bit cell replacement to spare cell or chip-by-chip internal timing optimization with fuse-blowing. It results in a drastic reduction in test cost and performance yield improvement.
Citation:
O. Hirabayashi, A. Suzuki, T. Yabe, A. Kawasumi, Y. Takeyama, K. Kushida, A. Tohata, N. Otsuka, "DFT Techniques for Wafer-Level At-Speed Testing of High-Speed SRAMs," itc, pp.164, International Test Conference 2002 (ITC'02), 2002
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