5th International Symposium on Quality Electronic Design (ISQED'04)
Substrate Coupling: Modeling, Simulation and Design Perspectives
San Jose, California
March 22-March 24
ISBN: 0-7695-2093-6
The finite impedance of silicon substrates has several consequences for the design and performance of ICs. In this paper we discuss the state of the art in the areas of modeling and simulation of these effects. An overview of various modeling techniques is presented, with emphasis on integral-equation based boundary-element techniques. Numerical stability issues related to these techniques are discussed from a physical viewpoint. Impact on circuit design is considered by the means of specific examples.
Index Terms:
substrate coupling, substrate noise, digital noise, power supply noise, impact ionization, constraint-driven optimization, boundary element method, finite element method, discrete cosine transform, fast fourier transform
Citation:
Ranjit Gharpurey, Edoardo Charbon, "Substrate Coupling: Modeling, Simulation and Design Perspectives," isqed, pp.283-290, 5th International Symposium on Quality Electronic Design (ISQED'04), 2004