Electrical and Thermal Analysis for System-in-a-Package (SiP) Implementation Platform

I
ISQED
2003
Fourth International Symposium on Quality Electronic Design
Abstract - Electrical and Thermal Analysis for System-in-a-Package (SiP) Implementation Platform

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Fourth International Symposium on Quality Electronic Design

San Jose, California

March 24-March 26

ISBN: 0-7695-1881-8

	ASCII Text	x
	Michael Wang, Katsuharu Suzuki, Wayne Dai, "Electrical and Thermal Analysis for System-in-a-Package (SiP) Implementation Platform," Quality Electronic Design, International Symposium on, pp. 229, Fourth International Symposium on Quality Electronic Design, 2003.

	BibTex	x
	@article{ 10.1109/ISQED.2003.1194736, author = {Michael Wang and Katsuharu Suzuki and Wayne Dai}, title = {Electrical and Thermal Analysis for System-in-a-Package (SiP) Implementation Platform}, journal ={Quality Electronic Design, International Symposium on}, volume = {0}, year = {2003}, isbn = {0-7695-1881-8}, pages = {229}, doi = {http://doi.ieeecomputersociety.org/10.1109/ISQED.2003.1194736}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - CONF JO - Quality Electronic Design, International Symposium on TI - Electrical and Thermal Analysis for System-in-a-Package (SiP) Implementation Platform SN - 0-7695-1881-8 SP EP A1 - Michael Wang, A1 - Katsuharu Suzuki, A1 - Wayne Dai, PY - 2003 KW - null VL - 0 JA - Quality Electronic Design, International Symposium on ER -

Michael Wang, University of California, Santa Cruz

Katsuharu Suzuki, University of California, Santa Cruz

Wayne Dai, University of California, Santa Cruz

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/ISQED.2003.1194736

This paper presents an electrical and thermal performance analysis of System-in-a-Package (SiP) memory/logic implementation platform based on Chip-Laminate- Chip (CLC) technology. Internal IO interface inside CLC module has been modeled and compared with Stack-Chip (SC) implementation. Thermal analysis, including comparison against Stack-Chip and System-on-a- Chip (SoC) is also presented. It is demonstrated that CLC technology provides significant performance advantage over conventional SiP technologies and has great impact on future system-level integration.

Citation:

Michael Wang, Katsuharu Suzuki, Wayne Dai, "Electrical and Thermal Analysis for System-in-a-Package (SiP) Implementation Platform," isqed, pp.229, Fourth International Symposium on Quality Electronic Design, 2003

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