Fourth International Symposium on Quality Electronic Design
Design Considerations of Scaled Sub-0.1 ?m PD/SOI CMOS Circuits
San Jose, California
March 24-March 26
ISBN: 0-7695-1881-8
This paper reviews the circuit design considerations of scaled sub-0.1 ?m partially-depleted SOI (PD/SOI) CMOS circuits for high-performance digital applications. The impact of technology/device scaling and design challenges are highlighted. Unique design aspects and issues resulting from the scaling of PD/SOI device structure, such as parasitic bipolar effect and reduced-VT leakage, hysteretic VT variation, low-voltage impact ionization, higher VT,lin to maintain adequate VT,sat; scaling/ thinning of Si film, gate-to-body tunneling current, self-heating, soft error rate (SER), and the introduction of strained-Si channel on SOI are addressed.
Citation:
C. T. Chuang, R. V. Joshi, R. Puri, K. Kim, "Design Considerations of Scaled Sub-0.1 ?m PD/SOI CMOS Circuits," isqed, pp.153, Fourth International Symposium on Quality Electronic Design, 2003