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Fourth International Symposium on Quality Electronic Design
Design Considerations of Scaled Sub-0.1 ?m PD/SOI CMOS Circuits
San Jose, California
March 24-March 26
ISBN: 0-7695-1881-8
C. T. Chuang, IBM T. J. Watson Research Center
R. V. Joshi, IBM T. J. Watson Research Center
R. Puri, IBM T. J. Watson Research Center
K. Kim, IBM T. J. Watson Research Center
This paper reviews the circuit design considerations of scaled sub-0.1 ?m partially-depleted SOI (PD/SOI) CMOS circuits for high-performance digital applications. The impact of technology/device scaling and design challenges are highlighted. Unique design aspects and issues resulting from the scaling of PD/SOI device structure, such as parasitic bipolar effect and reduced-VT leakage, hysteretic VT variation, low-voltage impact ionization, higher VT,lin to maintain adequate VT,sat; scaling/ thinning of Si film, gate-to-body tunneling current, self-heating, soft error rate (SER), and the introduction of strained-Si channel on SOI are addressed.
Citation:
C. T. Chuang, R. V. Joshi, R. Puri, K. Kim, "Design Considerations of Scaled Sub-0.1 ?m PD/SOI CMOS Circuits," isqed, pp.153, Fourth International Symposium on Quality Electronic Design, 2003
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