In this paper, based on simulations of top-level interconnects and CMOS devices of industrial 0.18 technology, the rules to screen out those inductive interconnects requiring more accurate RLC considerations, and the victim wires potentially having significant inductive noises are developed. The presented criteria constitute a tighter self-inductance screening rule than those found in previously published work. The 2x mutual-inductance screening rule is presented and verified. The differences in on-chip inductance consideration, the significant frequency of a trapezoidal pulse, and the circuit modeling of on-chip inductance are also discussed.