ISBN: 0-8186-8183-7

J.R. Morros, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain

F. Marques, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain

S. Servetto, Illinois Univ., Urbana, IL, USA

K. Ramchandran, Illinois Univ., Urbana, IL, USA

K. Nahrstedt, Illinois Univ., Urbana, IL, USA

A. Ortega, Illinois Univ., Urbana, IL, USA

F.W. Meier, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA

G.M. Schuster, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA

A.K. Katsaggelos, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA

J. Webb

K. Oehler

U. Horn

T. Wiegand

B. Girod

S.L. Regunathan, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA

K. Rose, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA

J. Garcia-Frias

D. Benyamin

J. Villasenor

D. Lin

J-J Chen

J. Su

R Mersereau

D. Mukherjee

S. Mitra

K. Yang

A. Jacquin

N. Jayant

J. Lee

K. Stuhlmuller, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany

B. Girod, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany

T. Wiegand

X. Zhang

B. Girod

Liang-Jin Lin, Div. of Res. & Dev., Ulead Syst. Inc., Torrance, CA, USA

A. Ortega, Div. of Res. & Dev., Ulead Syst. Inc., Torrance, CA, USA

G.J. Conklin, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA

S.S. Hemami, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA

Jiangtao Wen, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA

J.D. Villasenor, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA

Chun-Ho Cheung, Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong

Lai-Man Po, Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong

N. Farber

B. Girod

I. Kozintsev

K. Ramchandran

B.S. Srinivas, Sarnoff Corp., Princeton, NJ, USA

Robert Swann

Nick Kingsbury

M. Budagavi, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA

J.D. Gibson, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA

Joon-Ho Chang, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea

Jeong-Kwon Kim, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea

Choong Woong Lee, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea

R. Llados-Bernaus, Dept. of Electr. Eng., Notre Dame Univ., IN, USA

R.L. Stevenson, Dept. of Electr. Eng., Notre Dame Univ., IN, USA

P. Salama, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA

N. Shroff, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA

E.J. Delp, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA

Mei-Juan Chen, Inst. of Electr. Eng., Nat. Dong Hwa Univ., Hualien, Taiwan

Liang-Gee Chen, Inst. of Electr. Eng., Nat. Dong Hwa Univ., Hualien, Taiwan

Ruei-Xi Chen, Inst. of Electr. Eng., Nat. Dong Hwa Univ., Hualien, Taiwan

Sheng Liu, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA

E.J. Delp, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA

P. Brigger

S. Bacharach

A. Aldroubi

M. Unser

Y. Zhu

N. Pelc

V. Solo, Dept. of Stat., Macquarie Univ., Sydney, NSW, Australia

E. Brown, Dept. of Stat., Macquarie Univ., Sydney, NSW, Australia

R. Weisskoff, Dept. of Stat., Macquarie Univ., Sydney, NSW, Australia

S. Hirano

N. Kamiura

Y. Hata

M. Ishikawa

L. Aurdal

I. Block

H. Maitre

C. Graffigne

C. Adamsbaum

S. Young

R. Swift

K. Ramaswamy

W. Higgins

V. Ruiz

B. Fotopoulos

A. Skodras

A. Constantinides

Y.-K. Lai

L.-G. Chen

T.-H. Tsai

P.-C. Wu

M. Bennamoun

T. Yoshida

H. Katoh

Y. Sakai

C.-M. Fan

N. Namazi

P. Meulemans

R. Wilson

J. Zhang

M. Ahmad

M. Swamy

W. Jiang

A. Ortega

C.C. Lin, Syracuse Univ., NY, USA

D.J. Pease, Syracuse Univ., NY, USA

R.R. Raje, Syracuse Univ., NY, USA

F. Pedersini

A. Sarti

S. Tubaro

F. Le Coat

E. Pissaloux

P. Bonnin

T. Garie

R. Durbin

A. Tissot

N. Paragios, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France

R. Deriche, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France

J. Magarey

A. Kokaram

N. Kingsbury

A.C. Kokaram, Dept. of Eng., Cambridge Univ., UK

S.J. Godsill, Dept. of Eng., Cambridge Univ., UK

E. Sayrol

S. Shah

J. Aggarwal

J. Eledath

A. Jain

G. Healey

A. Massmann, AG Angewandte Inf., Bielefeld Univ., Germany

S. Posch, AG Angewandte Inf., Bielefeld Univ., Germany

G. Sagerer, AG Angewandte Inf., Bielefeld Univ., Germany

D. Schluter, AG Angewandte Inf., Bielefeld Univ., Germany

H. Heijmans

T. Randen

J. Husoy

Y. Qu

P. Kelly

H. Derin

W.-B. Gong

M. Ikehara

T. Tran

T. Nguyen

S. Moni

G. Peake

T. Tan

A. Winter

H. Maitre

N. Cambou

E. Legrand

Q. Li

Y. Yoshida

N. Nakamori

R.G. Lane, Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand

R. Irwan, Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand

Dong Wei, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA

B.L. Evans, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA

A.C. Bovik, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA

D. Sow, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA

A. Eleftheriadis, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA

A. Yagle

K. Aizawa, Dept. of Electr. Eng., Tokyo Univ., Japan

T. Hamamoto, Dept. of Electr. Eng., Tokyo Univ., Japan

Y. Ohtsuka, Dept. of Electr. Eng., Tokyo Univ., Japan

M. Hatori, Dept. of Electr. Eng., Tokyo Univ., Japan

M. Abe, Dept. of Electr. Eng., Tokyo Univ., Japan

F. Golchin, Sch. of Microelectron. Eng., Griffith Univ., Brisbane, Qld., Australia

K.K. Paliwal, Sch. of Microelectron. Eng., Griffith Univ., Brisbane, Qld., Australia

M. Iwahashi

S. Fukuma

N. Kambayashi

J.D. Pfefferman, Fac. de Ingenieria, Buenos Aires Univ., Argentina

H.J. Gonzalez, Fac. de Ingenieria, Buenos Aires Univ., Argentina

B. Cernuschi-Frias, Fac. de Ingenieria, Buenos Aires Univ., Argentina

Ho-Youl Jung, Inst. Nat. des Sci. Appliquees, Villeurbanne, France

R. Prost, Inst. Nat. des Sci. Appliquees, Villeurbanne, France

V.N. Ramaswamy, Center for Microelectron. Res., Univ. of South Florida, Tampa, FL, USA

K.R. Namuduri, Center for Microelectron. Res., Univ. of South Florida, Tampa, FL, USA

N. Ranganathan, Center for Microelectron. Res., Univ. of South Florida, Tampa, FL, USA

M.D. Reavy, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA

C.G. Boncelet, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA

S. Marusic, Sch. of Electron. Eng., La Trobe Univ., Bundoora, Vic., Australia

Guang Deng, Sch. of Electron. Eng., La Trobe Univ., Bundoora, Vic., Australia

D. Petrescu

M Gabbouj

Ying Zhang

Lai-Man Po

Ying-Lin Yu

O.C. Au, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong

M.L. Liou, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong

L.K. Ma, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong

S. Asgari, Western Digital Corp., Rochester, MN, USA

T.Q. Nguyen, Western Digital Corp., Rochester, MN, USA

W.A. Sethares, Western Digital Corp., Rochester, MN, USA

H. Honda, Sch. of Eng., Hokkaido Univ. Sapporo, Japan

M. Haseyama, Sch. of Eng., Hokkaido Univ. Sapporo, Japan

H. Kitajima, Sch. of Eng., Hokkaido Univ. Sapporo, Japan

S. Matsumoto, Sch. of Eng., Hokkaido Univ. Sapporo, Japan

M. Ruhl, Inst. fur Inf., Freiburg Univ., Germany

H. Hartenstein, Inst. fur Inf., Freiburg Univ., Germany

D. Saupe, Inst. fur Inf., Freiburg Univ., Germany

K. Barthel

S. Brandau

W. Hermesmeier

G. Heising

D.M. Bethel, Sch. of Electron. & Electr. Eng., Bath Univ., UK

D.M. Monro, Sch. of Electron. & Electr. Eng., Bath Univ., UK

M. Saeed, Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA

H.R. Rabiee, Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA

W.C. Karl, Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA

T.Q. Nguyen, Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA

V. Bhasharan, Hewlett-Packard Co., Palo Alto, CA, USA

K. Konstantinides, Hewlett-Packard Co., Palo Alto, CA, USA

G. Beretta, Hewlett-Packard Co., Palo Alto, CA, USA

B. Solaiman, Telecom Bretagne, Brest, France

R. Pyndiah, Telecom Bretagne, Brest, France

O. Aitsab, Telecom Bretagne, Brest, France

Ch. Roux, Telecom Bretagne, Brest, France

R.L. De Queiroz, Xerox Corp., Webster, NY, USA

D.W. Tyler, Schafer Corp., Albuquerque, NM, USA

C.L. Matson, Schafer Corp., Albuquerque, NM, USA

S.S.O. Choy, Dept. of Electron. Eng., Hong Kong Polytech., Kowloon, Hong Kong

Yuk-Hee Chan, Dept. of Electron. Eng., Hong Kong Polytech., Kowloon, Hong Kong

Wan-Chi Siu, Dept. of Electron. Eng., Hong Kong Polytech., Kowloon, Hong Kong

S. Yang

Y.-H. Hu

Kwok-Wai Cheung, Dept. of Electron. Eng., City Univ. of Hong Kong, Hong Kong

Lai-Man Po, Dept. of Electron. Eng., City Univ. of Hong Kong, Hong Kong

Jung-Jae Chao, Inst. of Maritime Technol., Ocean Univ., Taiwan, China

Chyi-Chyng Lin, Inst. of Maritime Technol., Ocean Univ., Taiwan, China

T. Aach

D. Kunz

L. Alparone

A. Garzelli

R. Jonsson

Juan Liu, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA

P. Moulin, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA

S.G. Chang, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA

M. Vetterli, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA

A.O. Hero, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA

J. O'Neill, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA

W.J. Williams, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA

D. Van Dyck

J. Garcia

J.M. Nash, Dept. of Electron. & Comput. Sci., Southampton Univ., UK

J.N. Carter, Dept. of Electron. & Comput. Sci., Southampton Univ., UK

M.S. Nixon, Dept. of Electron. & Comput. Sci., Southampton Univ., UK

F. Jordan

S. Horbelt

T. Ebrahimi

M.M. Perez, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, U

T.J. Dennis, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, U

H.R. Tizhoosh, Inst. for Meas. Technol. & Electron., Magdeburg Univ. of Technol., Germany

G. Krell, Inst. for Meas. Technol. & Electron., Magdeburg Univ. of Technol., Germany

B. Michaelis, Inst. for Meas. Technol. & Electron., Magdeburg Univ. of Technol., Germany

M. Ebbecke

M.B.H. Ali

A. Dengel

F.G. Lorca, CNRS-ENSEA/UCP, Cergy Pontoise, France

L. Kessal, CNRS-ENSEA/UCP, Cergy Pontoise, France

D. Demigny, CNRS-ENSEA/UCP, Cergy Pontoise, France

N.J. Redding

R.C. Whatmough

D. Kil

F. Shin

P. Eisert, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany

B. Girod, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany

P. Gamba, Dipt. di Elettronica, Pavia Univ., Italy

M. Lilla, Dipt. di Elettronica, Pavia Univ., Italy

A. Mecocci, Dipt. di Elettronica, Pavia Univ., Italy

L. Bonnaud, IRISA, Rennes, France

C. Labit, IRISA, Rennes, France

V.V. Anh, Centre in Stat. Sci. & Ind. Math., Queensland Univ. of Technol., Brisbane, Qld., Australia

Q. Tieng, Centre in Stat. Sci. & Ind. Math., Queensland Univ. of Technol., Brisbane, Qld., Australia

T.D. Bui, Centre in Stat. Sci. & Ind. Math., Queensland Univ. of Technol., Brisbane, Qld., Australia

G. Chen, Centre in Stat. Sci. & Ind. Math., Queensland Univ. of Technol., Brisbane, Qld., Australia

F. Ng

J. Kovacevic

O. Yanez-Suarez, Dept. of Electr. Eng., Colorado State Univ., Fort Collins, CO, USA

M.R. Azimi-Sadjadi, Dept. of Electr. Eng., Colorado State Univ., Fort Collins, CO, USA

O. Alata, GDR-ISIS, CNRS, Talence, France

P. Baylou, GDR-ISIS, CNRS, Talence, France

M. Najim, GDR-ISIS, CNRS, Talence, France

J.P. Havlicek, Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK, USA

J.W. Havlicek, Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK, USA

A.C. Bovik, Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK, USA

P. Kalocsai, Univ. of Southern California, Los Angeles, CA, USA

D. Biggs

M. Andrews

P. Komprobst, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France

R. Deriche, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France

G. Aubert, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France

A. Teschioni, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy

C.S. Regazzoni, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy

E. Stringa, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy

U.A. Al-Suwailem, Dept. of Electr. Eng., King Fahd Univ. of Pet. & Miner., Dhahran, Saudi Arabia

J. Keller, Dept. of Electr. Eng., King Fahd Univ. of Pet. & Miner., Dhahran, Saudi Arabia

S. Teboul, Lab. I3S, Nice Univ., Valbonne, France

L. Blanc-Feraud, Lab. I3S, Nice Univ., Valbonne, France

G. Aubert, Lab. I3S, Nice Univ., Valbonne, France

M. Barlaud, Lab. I3S, Nice Univ., Valbonne, France

Min-Cheol Hong, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA

Moon Gi Kang, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA

A.K. Katsaggelos, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA

Xinquan Shen, Dept. of Electron. & Electr. Eng., Birmingham Univ., UK

M. Spann, Dept. of Electron. & Electr. Eng., Birmingham Univ., UK

K. Kamei

M. Maruyama

K. Seo

P. Undrell

K. Delibasis

P. de Smet, Dept. for Telecommun. & Inf. Process., Ghent Univ., Belgium

D. de Vleeschauwer, Dept. for Telecommun. & Inf. Process., Ghent Univ., Belgium

P.M.Q. Aguiar

J.M.F. Moura

J. Yu, Dept. of Electr. Eng., Princeton Univ., NJ, US

G. Bozdagi, Dept. of Electr. Eng., Princeton Univ., NJ, US

S. Harrington, Dept. of Electr. Eng., Princeton Univ., NJ, US

B. Gunsel, Dept. of Electr. Eng., Rochester Univ., NY, USA

A. Murat Tekalp, Dept. of Electr. Eng., Rochester Univ., NY, USA

P.J.L. van Beek, Dept. of Electr. Eng., Rochester Univ., NY, USA

J. Kaufhold, BME Dept., Boston Univ., MA, USA

M. Schneider, BME Dept., Boston Univ., MA, USA

W.C. Karl, BME Dept., Boston Univ., MA, USA

A. Willsky, BME Dept., Boston Univ., MA, USA

Seung Chul Yoon, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA

K. Ratakonda, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA

N. Ahuja, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA

Chuang Gu, Microsoft Corp., Redmond, WA, USA

Ming-Chieh Lee, Microsoft Corp., Redmond, WA, USA

B.K. Low, Dept. of Electron. & Electr. Eng., De Monfort Univ., Leicester, UK

M.K. Ibrahim, Dept. of Electron. & Electr. Eng., De Monfort Univ., Leicester, UK

A. Aydm Alatan, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

E. Tuncel, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

L. Onural, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

E. Sahouria, Dept. of Electr. Eng., California Univ., Berkeley, CA, USA

A. Zakhor, Dept. of Electr. Eng., California Univ., Berkeley, CA, USA

Jenq-Neng Hwang, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA

Jeongnam Youn, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA

S. Deshpande, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA

Ming-Ting Sun, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA

Y. Deng

B. Manjunath

K.J. Han, Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA

A.H. Tewfik, Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA

N. Vasconcelos, Media Lab., MIT, Cambridge, MA, USA

A. Lippman, Media Lab., MIT, Cambridge, MA, USA

T. Otsuka

J. Ohya

J. Nam, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA

A. Enis Cetin, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA

A.H. Tewfik, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA

Thomas E. Slowe, The Media Laboratory

Ivan Marsic

Caip Center, Rutgers University

Mitchell D. Swanson, University of Minnesota

Bin Zhu, University of Minnesota

Ahmed H. Tewfik, University of Minnesota

T. Ikenaga

T. Oguna

S.L. Wood, Dept. of Electr. Eng., Santa Clara Univ., CA, USA

M. Mattavelli

S. Brunetton

D. Mlynek

J. Chen

K. Liu

Anthony S. Wright, Oklahoma State University

Scott T. Acton, Oklahoma State University

Mamoru Nakanishi

Takeshi Ogura

W. Lin

K. H. Goh

B. J. Tye

G. A. Powell

T. Ohya

S. Adachi

D. Schmidradler, Inst. of Flexible Autom., Wien Univ. of Technol., Austria

W. Van Dyck, Inst. of Flexible Autom., Wien Univ. of Technol., Austria

K. Furst, Inst. of Flexible Autom., Wien Univ. of Technol., Austria

H. Hufnagl, Inst. of Flexible Autom., Wien Univ. of Technol., Austria

H. Boelcskei, INTHFT, Vienna University of Technology

T. Stranz, INTHFT, Vienna University of Technology

F. Hlawatsch, INTHFT, Vienna University of Technology

R. Sucher, INTHFT, Vienna University of Technology

Magatho A. Mello, Washington State University

Roberto H. Bamberger, Washington State University

Thomas R. Fischer, Washington State University

Innho Jee, Sch. of Electron., Electr. & Comput. Eng., Hongik Univ., Chungnam, South Korea

V. Areekul, Dept. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA

R.H. Bamberger, Dept. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA

J. Karlekar

P. Poonacha

U. Desai

A.M. Murching, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

J.W. Woods, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

H. Benoit-Cattin

R. Prost

A. Baskurt

K. Sawada

T. Yoshida

D. M. Monro, University of Bath

G. J. Dickson, University of Bath

Soo-Chul Han

John W. Woods

M. Iwahashi, Dept. of Electr. Eng., Nagaoka Univ. of Technol., Niigata, Japan

S. Fukuma, Dept. of Electr. Eng., Nagaoka Univ. of Technol., Niigata, Japan

A. Hosotani, Dept. of Electr. Eng., Nagaoka Univ. of Technol., Niigata, Japan

N. Kambayashi, Dept. of Electr. Eng., Nagaoka Univ. of Technol., Niigata, Japan

Bing-Bing Chai, University of Missouri-Columbia

Jozsef Vass, University of Missouri-Columbia

Xinhua Zhuang, University of Missouri-Columbia

Aria Nosratinia, Rice University

K.-K. Ma

L. Huang

Arild Fuldseth, Norwegian University of Science and Technology

Ilangko Balasingham, Norwegian University of Science and Technology

Tor A. Ramstad, Norwegian University of Science and Technology

Zhong-yu Chen, Div. of Eng., Texas Univ., San Antonio, TX, USA

M. Desai, Div. of Eng., Texas Univ., San Antonio, TX, USA

Xiao-Ping Zhang, Div. of Eng., Texas Univ., San Antonio, TX, USA

G.R. Rajugopal, Dept. of Syst. & Comput. Eng., Carleton Univ., Ottawa, Ont., Canada

R.H.M. Hafez, Dept. of Syst. & Comput. Eng., Carleton Univ., Ottawa, Ont., Canada

G. Poulalion, CEA/CESTA, Le Barp, France

O. Flous, CEA/CESTA, Le Barp, France

S. Morvan, CEA/CESTA, Le Barp, France

M. Najim, CEA/CESTA, Le Barp, France

Bin Zhu

Mitchell D. Swanson

Ahmed H. Tewfik

F.P. Lovergine

A. Branca

G. Attolico

A. Distante

O. Deforges, ARTIST laboratory, INSA Rennes

N. Normand, SEI laboratory, IRESTE

Mitchell D. Swanson, University of Minnesota

Bin Zhu, University of Minnesota

Ahmed H. Tewfik, University of Minnesota

Minerva M. Yeung, IBM T. J. Watson Research Center,

Fred Mintzer, IBM T. J. Watson Research Center,

T. Martin, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France

J. Idier, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France