DSP for the Third Generation Wireless Communications

I
ICCD
1999
1999 IEEE International Conference on Computer Design (ICCD'99)
Abstract - DSP for the Third Generation Wireless Communications

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1999 IEEE International Conference on Computer Design (ICCD'99)

Austin, Texas

October 10-October 13

ISBN: 0-7695-0406-X

	ASCII Text	x
	Uming Ko, Mike McMahan, Edgar Auslander, "DSP for the Third Generation Wireless Communications," Computer Design, International Conference on, pp. 516, 1999 IEEE International Conference on Computer Design (ICCD'99), 1999.

	BibTex	x
	@article{ 10.1109/ICCD.1999.808590, author = {Uming Ko and Mike McMahan and Edgar Auslander}, title = {DSP for the Third Generation Wireless Communications}, journal ={Computer Design, International Conference on}, volume = {0}, year = {1999}, issn = {1063-6404}, pages = {516}, doi = {http://doi.ieeecomputersociety.org/10.1109/ICCD.1999.808590}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - CONF JO - Computer Design, International Conference on TI - DSP for the Third Generation Wireless Communications SN - 1063-6404 SP EP A1 - Uming Ko, A1 - Mike McMahan, A1 - Edgar Auslander, PY - 1999 VL - 0 JA - Computer Design, International Conference on ER -

Uming Ko, Texas Instruments Incorporated

Mike McMahan, Texas Instruments Incorporated

Edgar Auslander, Texas Instruments Incorporated

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/ICCD.1999.808590

The following paper offers a perspective of cellular standards, from first-generation (1G) and second-generation (2G), to the emerging third generation (3G). Architectures of existing 2G and future 3G systems are compared. Micro-architecture of the digital signal processor (DSP) for 2G is reviewed and requirements for 3G are summarized.

Citation:

Uming Ko, Mike McMahan, Edgar Auslander, "DSP for the Third Generation Wireless Communications," iccd, pp.516, 1999 IEEE International Conference on Computer Design (ICCD'99), 1999

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