The methodology for the integration of design domains towards the purpose of controlling dynamic mechatronics systems is the current challenge of the modern engineer. Scaling issues for both the mechanical and electrical components parameters are critical to the successful design and implementation of a mechatronic system. In approaching the scaling design methodology for future submicron fabrication, new disciplines of symbolic matrix techniques and dimensional analysis must be developed and applied in the design of these mechatronics systems. This paper presents both an overview of the techniques and insight using computer aided design packages for the blending of symbolic matrix techniques using the admittance matrix created by SPICE and dimensional analysis using Buckingham's pi parameters.