19th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (DFT'04)
Defect Avoidance in a 3-D Heterogeneous Sensor
Cannes, France
October 10-October 13
ISBN: 0-7695-2241-6
A 3D Heterogeneous Sensor using a stacked chip is investigated. Optical Active Pixel Sensor and IR Bolometer detectors are combined to create a multispectral pixel for aligned color and infrared imaging. An acoustic and seismic micromachined sensor array obtains sound spectral and directional information. For the optical/IR imagers fault tolerant APS cells and software methods are used for defect avoidance. For the acoustic/seismic array spare detectors are combined with signal processing to compensate for changes in detector positions due to defects. The sensor fault distribution in turn impacts the defect avoidance in the fault tolerant TESH networked processors analyzing the sensor array.
Citation:
Glenn H. Chapman, Vijay Jain, Shekhar Bhansali, "Defect Avoidance in a 3-D Heterogeneous Sensor," dft, pp.67-75, 19th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (DFT'04), 2004