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Data Compression Conference (DCC '95)
Snowbird, Utah
March 28-March 30
ISBN: 0-8186-7012-6
Table of Contents
Session 1
Navin Chaddha, Comput. Syst. Lab., Stanford Univ., CA, USA
Mohan Vishwanath, Comput. Syst. Lab., Stanford Univ., CA, USA
P.A. Chou, Comput. Syst. Lab., Stanford Univ., CA, USA
pp. 3
V.K. Goyal, Dept. of Electr. Eng., California Univ., Berkeley, CA, USA
M. Vetterli, Dept. of Electr. Eng., California Univ., Berkeley, CA, USA
N.T. Thao, Dept. of Electr. Eng., California Univ., Berkeley, CA, USA
pp. 13
P.C. Cosman, Minnesota Univ., Minneapolis, MN, USA
S.M. Perlmutter, Minnesota Univ., Minneapolis, MN, USA
K.O. Perlmutter, Minnesota Univ., Minneapolis, MN, USA
pp. 33
Sangeeta Ramakrishnan, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
K. Rose, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Gersho, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 42
Session 2
J.G. Cleary, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
W.J. Teahan, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
I.H. Witten, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
pp. 52
E.S. Ristad, Dept. of Comput. Sci., Princeton Univ., NJ, USA
R.G. Thomas, III, Dept. of Comput. Sci., Princeton Univ., NJ, USA
pp. 62
S. Bunton, Dept. of Comput. Sci. & Eng., Washington Univ., Seattle, WA, USA
pp. 72
M. Feder, Dept. of Electr. Eng., Tel Aviv Univ., Israel
N. Merhav, Dept. of Electr. Eng., Tel Aviv Univ., Israel
pp. 82
S. Forchhammer, Inst. of Telecommun., Tech. Univ. Denmark, Lyngby, Denmark
J. Rissanen, Inst. of Telecommun., Tech. Univ. Denmark, Lyngby, Denmark
pp. 92
Session 3
B. Fowler, Inf. Syst. Lab., Stanford Univ., CA, USA
R. Arps, Inf. Syst. Lab., Stanford Univ., CA, USA
A. El Gamal, Inf. Syst. Lab., Stanford Univ., CA, USA
D. Yang, Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 102
R.A. Vander Kam, Inf. Syst. Lab., Stanford Univ., CA, USA
R.M. Gray, Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 112
R.R. Estes, Jr., Center for Image Process. & Integrated Comput., California Univ., Davis, CA, US
V.R. Algazi, Center for Image Process. & Integrated Comput., California Univ., Davis, CA, US
pp. 122
Xiaolin Wu, Dept. of Comput. Sci., Univ. of Western Ontario, London, Ont., Canada
Yonggang Fang, Dept. of Comput. Sci., Univ. of Western Ontario, London, Ont., Canada
pp. 132
K. Culik, II, Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA
J. Kari, Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA
pp. 142
Session 4
H. Nagumo, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
Mi Lu, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
K. Watson, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 162
D. Belinskaya, Dept. of Comput. Sci., Brandeis Univ., Waltham, MA, USA
S. DeAgostino, Dept. of Comput. Sci., Brandeis Univ., Waltham, MA, USA
J.A. Storer, Dept. of Comput. Sci., Brandeis Univ., Waltham, MA, USA
pp. 172
Kar-Ming Cheung, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
A. Kiely, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
pp. 182
A. Moffat, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
A. Turpin, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
J. Katajainen, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
pp. 192
A. Moffat, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
R. Neal, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
I.H. Witten, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
pp. 202
Session 5
A. Zandi, RICOH California Res. Center, Menlo Park, CA, USA
J.D. Allen, RICOH California Res. Center, Menlo Park, CA, USA
E.L. Schwartz, RICOH California Res. Center, Menlo Park, CA, USA
M. Boliek, RICOH California Res. Center, Menlo Park, CA, USA
pp. 212
J. Kominek, Dept. of Comput. Sci., Waterloo Univ., Ont., Canada
pp. 242
C.F. Barnes, Georgia Tech. Res. Inst., Atlanta, GA, USA
J.P. Watkins, Georgia Tech. Res. Inst., Atlanta, GA, USA
pp. 252
Session 6
G. Louchard, Lab. d'Inf. Theorique, Univ. Libre de Bruxelles, Belgium
W. Szpankowski, Lab. d'Inf. Theorique, Univ. Libre de Bruxelles, Belgium
pp. 262
D.T. Hoang, Dept. of Comput. Sci., Duke Univ., Durham, NC, USA
P.M. Long, Dept. of Comput. Sci., Duke Univ., Durham, NC, USA
J.S. Vitter, Dept. of Comput. Sci., Duke Univ., Durham, NC, USA
pp. 272
Shenfeng Chen, Dept. of Comput. Sci., Duke Univ., Durham, NC, USA
J.H. Reif, Dept. of Comput. Sci., Duke Univ., Durham, NC, USA
pp. 282
Chia-Yuan Teng, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
D.L. Neuhoff, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 292
Session 7
Zheng Gao, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
Feng Chen, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
B. Belzer, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
J. Villasenor, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 312
Viresh Ratnakar, Dept. of Comput. Sci., Wisconsin Univ., Madison, WI, USA
M. Livny, Dept. of Comput. Sci., Wisconsin Univ., Madison, WI, USA
pp. 332
M. Crouse, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
Kannan Ramchandran, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 342
A. Docef, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
F. Kossentini, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
W.C. Chung, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 352
Session 8
B. Moghaddam, Media Lab., MIT, Cambridge, MA, USA
A. Pentland, Media Lab., MIT, Cambridge, MA, USA
pp. 362
K.S. Prashant, Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
V.J. Mathews, Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
P.J. Hahn, Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
pp. 371
W.C. Chung, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
F. Kossentini, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 381
A. Nosratinia, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
M.T. Orchard, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 391
J.V. Gisladottir, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
M.T. Orchard, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 401
R. Neff, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
A. Zakhor, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 411
Poster Session
A. de la Cruz Nogueiras, Int. Center for Inf. & Electron., INTEREVM, Mosocw, Russia
M. Gamez Lau, Int. Center for Inf. & Electron., INTEREVM, Mosocw, Russia
A. Cerdeira Altuzarra, Int. Center for Inf. & Electron., INTEREVM, Mosocw, Russia
M. Estrada del Cueto, Int. Center for Inf. & Electron., INTEREVM, Mosocw, Russia
P. Goga, Int. Center for Inf. & Electron., INTEREVM, Mosocw, Russia
pp. 422
C. Constantinescu, Dept. of Comput. Sci., Brandeis Univ., Waltham, MA, USA
J.A. Storer, Dept. of Comput. Sci., Brandeis Univ., Waltham, MA, USA
pp. 423
M. Datcu, DLR, German Aerosp. Res. Establ., Wessling, Germany
G. Schwarz, DLR, German Aerosp. Res. Establ., Wessling, Germany
K. Schmidt, DLR, German Aerosp. Res. Establ., Wessling, Germany
C. Reck, DLR, German Aerosp. Res. Establ., Wessling, Germany
pp. 424
R. Brown, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
A.F. Boden, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
pp. 426
A.F. Boden, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
pp. 427
D. Zampunieris, Facultes Univ. Notre-Dame de la Paix, Namur, Belgium
B. Le Charlier, Facultes Univ. Notre-Dame de la Paix, Namur, Belgium
pp. 428
T. Kawashima, Sony Corp., Atsugi, Japan
T. Igarashi, Sony Corp., Atsugi, Japan
R. Hines, Sony Corp., Atsugi, Japan
M. Ogawa, Sony Corp., Atsugi, Japan
pp. 429
K. Pawlikowski, Dept. of Comput. Sci., Canterbury Univ., Christchurch, New Zealand
T. Bell, Dept. of Comput. Sci., Canterbury Univ., Christchurch, New Zealand
H. Emberson, Dept. of Comput. Sci., Canterbury Univ., Christchurch, New Zealand
P. Ashton, Dept. of Comput. Sci., Canterbury Univ., Christchurch, New Zealand
pp. 430
Bongjin Jung, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
W.P. Burleson, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
pp. 431
J. Kanai, ISRI, UNLV, Las Vegas, NV, USA
S. Latifi, ISRI, UNLV, Las Vegas, NV, USA
G. Rajarathinam, ISRI, UNLV, Las Vegas, NV, USA
G. Nagy, ISRI, UNLV, Las Vegas, NV, USA
H. Bunke, ISRI, UNLV, Las Vegas, NV, USA
pp. 432
A. Mehes, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
K. Zeger, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 433
S.P. Kim, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
X. Ginesta, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
pp. 434
Junchen Du, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
S.P. Kim, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
pp. 435
C.W. Barrett, Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
R.L. Frost, Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 436
Chi-Hung Chi, Dept. of Comput. Sci., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Chi-Kwun Kan, Dept. of Comput. Sci., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Kwok-Shing Cheng, Dept. of Comput. Sci., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Ling Wong, Dept. of Comput. Sci., Chinese Univ. of Hong Kong, Shatin, Hong Kong
pp. 437
M. Aizu, Dai Nippon Printing Co. Ltd., Tokyo, Japan
O. Nakagawa, Dai Nippon Printing Co. Ltd., Tokyo, Japan
M. Takagi, Dai Nippon Printing Co. Ltd., Tokyo, Japan
pp. 439
A. Sri-Krishna, Center for Adv. Comput. Studies, Univ. of Southwestern Louisiana, Lafayette, LA, USA
Cheehung Chu, Center for Adv. Comput. Studies, Univ. of Southwestern Louisiana, Lafayette, LA, USA
M. Bayoumi, Center for Adv. Comput. Studies, Univ. of Southwestern Louisiana, Lafayette, LA, USA
pp. 441
J. Tarhio, Dept. of Comput. Sci., Helsinki Univ., Finland
pp. 442
M.W. Maier, Dept. of Electr. & Comput. Eng., Alabama Univ., Huntsville, AL, USA
pp. 444
M.S. Moellenhoff, Dynetics Inc., Huntsville, AL, USA
M.W. Maier, Dynetics Inc., Huntsville, AL, USA
pp. 445
J. Kovacevic, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
R.J. Safranek, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
E.M. Yeh, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 446
A. Kiely, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
F. Pollara, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
pp. 447
J. Villasenor, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
R. Jain, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
B. Belzer, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
W. Boring, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
C. Chien, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
C. Jones, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
J. Liao, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
S. Molloy, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
S. Nazareth, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
B. Schoner, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
J. Short, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 448
G. Galvagno, Dipartimento di Elettronica e Inf., Padova Univ., Italy
G.A. Mian, Dipartimento di Elettronica e Inf., Padova Univ., Italy
R. Rinaldo, Dipartimento di Elettronica e Inf., Padova Univ., Italy
pp. 449
A.G. Al-Araj, Dept. of Electr. Eng., Nebraska Univ., Lincoln, NE, USA
K. Sayood, Dept. of Electr. Eng., Nebraska Univ., Lincoln, NE, USA
pp. 450
M. Bauer, Dept. of Electr. Eng., Nebraska Univ., Lincoln, NE, USA
K. Sayood, Dept. of Electr. Eng., Nebraska Univ., Lincoln, NE, USA
pp. 451
R. Bowen-Wright, Dept. of Electr. Eng., Nebraska Univ., Lincoln, NE, USA
K. Sayood, Dept. of Electr. Eng., Nebraska Univ., Lincoln, NE, USA
pp. 452
Xiaolin Wu, Dept. of Comput. Sci., Univ. of Western Ontario, London, Ont., Canada
pp. 453
J.N. Bradley, Los Alamos Nat. Lab., NM, USA
C.M. Brislawn, Los Alamos Nat. Lab., NM, USA
D.J. Quinlan, Los Alamos Nat. Lab., NM, USA
H.D. Zhang, Los Alamos Nat. Lab., NM, USA
V. Nuri, Los Alamos Nat. Lab., NM, USA
pp. 454
S. Kwong, Dept. of Comput. Sci., City Univ. of New York, NY, USA
K.F Man, Dept. of Comput. Sci., City Univ. of New York, NY, USA
pp. 455
N.D. Memon, Dept. of Comput. Sci., Northern Illinois Univ., DeKalb, IL, USA
K. Sayood, Dept. of Comput. Sci., Northern Illinois Univ., DeKalb, IL, USA
pp. 457
J.E. Fowler, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
R. Yagel, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 458
A. Bist, Rockwell Int. Corp., Newport Beach, CA, USA
pp. 459
K. Ferens, Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada
W. Kinsner, Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada
pp. 460
W. Kinsner, Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada
L. Wall, Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada
pp. 461
A. Bookstein, Center for Inf. & Language Studies, Chicago Univ., IL, USA
S.T. Klein, Center for Inf. & Language Studies, Chicago Univ., IL, USA
T. Raita, Center for Inf. & Language Studies, Chicago Univ., IL, USA
P. Lankinen, Center for Inf. & Language Studies, Chicago Univ., IL, USA
C.W. Sze, Center for Inf. & Language Studies, Chicago Univ., IL, USA
pp. 462
T. Acharya, Inst. of Syst. Res., Maryland Univ., College Park, MD, USA
A. Mukherjee, Inst. of Syst. Res., Maryland Univ., College Park, MD, USA
pp. 463
P.M. Fenwick, Dept. of Comput. Sci., Auckland Univ., New Zealand
S.A. Woolford, Dept. of Comput. Sci., Auckland Univ., New Zealand
pp. 465
J. Vaisey, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
M. Trumbo, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
pp. 466
Shen-Chuan Tai, Inst. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 467
Tong Lai Yu, Dept. of Comput. Sci., California State Univ., San Bernardino, CA, USA
pp. 468
A.M. Eskicioglu, Dept. of Comput. Sci., North Texas Univ., Denton, TX, USA
pp. 469
O. Kiselyov, Dept. of Comput. Sci., North Texas Univ., Denton, TX, USA
P. Fisher, Dept. of Comput. Sci., North Texas Univ., Denton, TX, USA
pp. 470
H. Raittinen, Dept. of Electr. Eng., Tampere Univ. of Technol., Finland
K. Kaski, Dept. of Electr. Eng., Tampere Univ. of Technol., Finland
pp. 471
S. Bhattacharjee, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Kharagpur, India
J. Bhattacharya, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Kharagpur, India
P.P. Chaudhuri, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Kharagpur, India
pp. 472
Y. Okada, Holography & Color Imaging Lab., Fujitsu Labs. Ltd., Japan
N. Satoh, Holography & Color Imaging Lab., Fujitsu Labs. Ltd., Japan
K. Murashita, Holography & Color Imaging Lab., Fujitsu Labs. Ltd., Japan
S. Yoshida, Holography & Color Imaging Lab., Fujitsu Labs. Ltd., Japan
pp. 473
W.K. Ng, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
C.V. Ravishankar, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 474
Jianhua Lin, Div. of Comput. Sci., Eastern Connecticut State Univ., Willimantic, CT, USA
pp. 477
Kwok Wing Sum, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong
R.D. Murch, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong
pp. 478
H.J. Lee, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
J.C. Liu, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
A.K. Chan, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
C.K. Chui, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
pp. 479
J.G. Cleary, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
W.J. Teahan, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
pp. 480
M.J. Turner, Image Res. Centre, De Montfort Univ., Leicester, UK
pp. 481
D.E. Tamir, Comput. Sci. Program, Florida Inst. of Technol., Melbourne, FL, USA
Chi-Yeon Park, Comput. Sci. Program, Florida Inst. of Technol., Melbourne, FL, USA
Wook-Sung Yoo, Comput. Sci. Program, Florida Inst. of Technol., Melbourne, FL, USA
pp. 482
A. Mohammed, Dept. of Electr. Eng., Nebraska Univ., Lincoln, NE, USA
K. Sayood, Dept. of Electr. Eng., Nebraska Univ., Lincoln, NE, USA
pp. 483
G. Kedem, Dept. of Comput. Sci. & Electr. Eng., North Carolina Univ., Durham, NC, USA
T. Alexander, Dept. of Comput. Sci. & Electr. Eng., North Carolina Univ., Durham, NC, USA
pp. 484
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