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Design, Automation and Test in Europe Conference and Exhibition Volume II (DATE'04)
Paris, France
February 16-February 20
ISBN: 0-7695-2085-5
ASCII Text
x 
 
Jacob R. Minz, Mohit Pathak, Sung Kyu Lim, "Net and Pin Distribution for 3D Package Global Routing," Design, Automation and Test in Europe Conference and Exhibition, vol. 2, pp. 21410, Design, Automation and Test in Europe Conference and Exhibition Volume II (DATE'04), 2004.
 
 
BibTex
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@article{ 10.1109/DATE.2004.1269111,
author = {Jacob R. Minz and Mohit Pathak and Sung Kyu Lim},
title = {Net and Pin Distribution for 3D Package Global Routing},
journal ={Design, Automation and Test in Europe Conference and Exhibition},
volume = {2},
year = {2004},
issn = {1530-1591},
pages = {21410},
doi = {http://doi.ieeecomputersociety.org/10.1109/DATE.2004.1269111},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - CONF
JO - Design, Automation and Test in Europe Conference and Exhibition
TI - Net and Pin Distribution for 3D Package Global Routing
SN - 1530-1591
SP
EP
A1 - Jacob R. Minz,
A1 - Mohit Pathak,
A1 - Sung Kyu Lim,
PY - 2004
KW - null
VL - 2
JA - Design, Automation and Test in Europe Conference and Exhibition
ER -
 
Jacob R. Minz, Georgia Institute of Technology
Mohit Pathak, Georgia Institute of Technology
Sung Kyu Lim, Georgia Institute of Technology
In this paper, we study the net and pin distribution problem for global routing targeting three dimensional packaging layout via System-on-Package (SOP). The routing environment for the new emerging mixed-signal SOP technology is more advanced than that of the conventional PCB or MCM technology — pins are located at all layers of SOP packaging substrate rather than the top-most layer only. This is the first work to formulate and solve the multi-layer net and pin distribution for layer, wirelength, and crosstalk minimization.
Citation:
Jacob R. Minz, Mohit Pathak, Sung Kyu Lim, "Net and Pin Distribution for 3D Package Global Routing," date, vol. 2, pp.21410, Design, Automation and Test in Europe Conference and Exhibition Volume II (DATE'04), 2004
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