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Design, Automation and Test in Europe Conference and Exhibition Volume I (DATE'04)
How Can System-Level Design Solve the Interconnect Technology Scaling Problem?
Paris, France
February 16-February 20
ISBN: 0-7695-2085-5
Francky Catthoor, IMEC and Katholieke Universiteit Leuven
Andrea Cuomo, St-Microelectronics
Grant Martin, Cadence Berkeley Laboratories
Patrick Groeneveld, Magma Design Automation
Lauwereins Rudy, IMEC and Katholieke Universiteit Leuven
Karen Maex, IMEC and Katholieke Universiteit Leuven
Patrick van de Steeg, Philips Semiconductor, Eindhoven
Ron Wilson, CMP Media
The scaling of interconnect technology hits a red brick wall: interconnect delay and power do not follow Moore's law anymore. The use of new materials like Cu and low-k alleviated the problem temporarily, but physical limits are being hit. What does this mean for system level design? The session starts with an embedded tutorial, given by an interconnect semiconductor technology expert, explaining the physics behind the interconnect problem and the degrees of freedom semiconductor technology offers system designers. Panelists will then express their thoughts and discuss with you how the interconnect problem can be solved by taking these degrees of freedom into account at the system design level. Views from industrial designers, CAD vendors, IC manufacturers and researchers will be presented.
Citation:
Francky Catthoor, Andrea Cuomo, Grant Martin, Patrick Groeneveld, Lauwereins Rudy, Karen Maex, Patrick van de Steeg, Ron Wilson, "How Can System-Level Design Solve the Interconnect Technology Scaling Problem?," date, vol. 1, pp.10332, Design, Automation and Test in Europe Conference and Exhibition Volume I (DATE'04), 2004
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