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Design, Automation and Test in Europe Conference and Exhibition (DATE'03 Designers' Forum)
A Top-Down Microsystems Design Methodology and Associated Challenges
Munich, Germany
March 03-March 07
ISBN: 0-7695-1870-2
ASCII Text
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Michael S. McCorquodale, Fadi H. Gebara, Keith L. Kraver, Eric D. Marsman, Robert M. Senger, Richard B. Brown, "A Top-Down Microsystems Design Methodology and Associated Challenges," Design, Automation and Test in Europe Conference and Exhibition, vol. 2, pp. 20292, Design, Automation and Test in Europe Conference and Exhibition (DATE'03 Designers' Forum), 2003.
 
 
BibTex
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@article{ 10.1109/DATE.2003.1186711,
author = {Michael S. McCorquodale and Fadi H. Gebara and Keith L. Kraver and Eric D. Marsman and Robert M. Senger and Richard B. Brown},
title = {A Top-Down Microsystems Design Methodology and Associated Challenges},
journal ={Design, Automation and Test in Europe Conference and Exhibition},
volume = {2},
year = {2003},
issn = {1530-1591},
pages = {20292},
doi = {http://doi.ieeecomputersociety.org/10.1109/DATE.2003.1186711},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - CONF
JO - Design, Automation and Test in Europe Conference and Exhibition
TI - A Top-Down Microsystems Design Methodology and Associated Challenges
SN - 1530-1591
SP
EP
A1 - Michael S. McCorquodale,
A1 - Fadi H. Gebara,
A1 - Keith L. Kraver,
A1 - Eric D. Marsman,
A1 - Robert M. Senger,
A1 - Richard B. Brown,
PY - 2003
KW - null
VL - 2
JA - Design, Automation and Test in Europe Conference and Exhibition
ER -
 
Michael S. McCorquodale, University of Michigan
Fadi H. Gebara, University of Michigan
Keith L. Kraver, University of Michigan
Eric D. Marsman, University of Michigan
Robert M. Senger, University of Michigan
Richard B. Brown, University of Michigan
An overview of microsystems technology is presented along with a discussion of the recent trends and challenges associated with its development. A typical bottom-up design methodology is described and we propose, in contrast, an efficient and effective top-down methodology. We illustrate its implementation with the development of a microsystem design that has been completed and fabricated in CMOS technology. Gaps in the tool capabilities are identified and suggestions for future directions in CAD tool support for microsystems technology are presented.
Citation:
Michael S. McCorquodale, Fadi H. Gebara, Keith L. Kraver, Eric D. Marsman, Robert M. Senger, Richard B. Brown, "A Top-Down Microsystems Design Methodology and Associated Challenges," date, vol. 2, pp.20292, Design, Automation and Test in Europe Conference and Exhibition (DATE'03 Designers' Forum), 2003
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