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2002 Design, Automation and Test in Europe Conference and Exhibition (DATE'02)
A Signature Test Framework for Rapid Production Testing of RF Circuits
Paris, France
March 04-March 08
ISBN: 0-7695-1471-5
Production test costs for today's RF circuits are rapidly escalating. Two factors are responsible for this cost escalation: (a) the high cost of RF ATEs and (b) long test times required by elaborate performance tests. In this paper, we propose a framework for low- cost signature test of RF circuits using modulation of a baseband test signal and subsequent demodulation of the DUT response. The demodulated response of the DUT is used as a "signature" from which all the performance specifications are predicted. The applied test signal is optimized in such a way that the error between the measured DUT performances and the predicted DUT performances is minimized. The proposed low-cost solution can be easily built into a load board that can be interfaced to an inexpensive tester.
Citation:
R. Voorakaranam, S. Cherubal, A. Chatterjee, "A Signature Test Framework for Rapid Production Testing of RF Circuits," date, pp.0186, 2002 Design, Automation and Test in Europe Conference and Exhibition (DATE'02), 2002
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