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Design, Automation and Test in Europe (DATE '00)
The Road to Better Reliability and Yield Embedded DfM Tools
Paris, France
March 27-March 30
ISBN: 0-7695-0537-6
ASCII Text
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Kees Veelenturf, "The Road to Better Reliability and Yield Embedded DfM Tools," Design, Automation and Test in Europe Conference and Exhibition, pp. 67, Design, Automation and Test in Europe (DATE '00), 2000.
 
 
BibTex
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@article{ 10.1109/DATE.2000.840017,
author = {Kees Veelenturf},
title = {The Road to Better Reliability and Yield Embedded DfM Tools},
journal ={Design, Automation and Test in Europe Conference and Exhibition},
volume = {0},
year = {2000},
issn = {1530-1591},
pages = {67},
doi = {http://doi.ieeecomputersociety.org/10.1109/DATE.2000.840017},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - CONF
JO - Design, Automation and Test in Europe Conference and Exhibition
TI - The Road to Better Reliability and Yield Embedded DfM Tools
SN - 1530-1591
SP
EP
A1 - Kees Veelenturf,
PY - 2000
KW - DfM
KW - yield improvement
KW - yield prediction
KW - wire spreading
VL - 0
JA - Design, Automation and Test in Europe Conference and Exhibition
ER -
 
Kees Veelenturf, Philips Semiconductors
This paper gives an overview of the different tools, needed for accomplishing optimal IC manufacturability and rapid technology learning during the successive phases of process maturity. The paper then describes two specific DfM tools that are in use within Philips Semiconductors.
Index Terms:
DfM, yield improvement, yield prediction, wire spreading
Citation:
Kees Veelenturf, "The Road to Better Reliability and Yield Embedded DfM Tools," date, pp.67, Design, Automation and Test in Europe (DATE '00), 2000
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