Design, Automation and Test in Europe (DATE '99)
Efficient 3D Modelling for Extraction of Interconnect Capacitances in Deep Submicron Dense Layouts
Munich, Germany
March 09-March 12
ISBN: 0-7695-0078-1
This paper introduces a set of analytical formulations for 3D modelling of inter-layer capacitances. Efficiency and accuracy are both guaranteed by the process characterization approach. Analytical modelling of interconnect capacitances is then demonstrated to be an helpful alternative to lookup tables or numerical simulations.
Citation:
A. Toulouse, D. Bernard, C. Landrault, P. Nouet, "Efficient 3D Modelling for Extraction of Interconnect Capacitances in Deep Submicron Dense Layouts," date, pp.576, Design, Automation and Test in Europe (DATE '99), 1999