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Design, Automation and Test in Europe (DATE '99)
Efficient Techniques for Modeling Chip-Level Interconnect, Substrate and Package Parasitics
Munich, Germany
March 09-March 12
ISBN: 0-7695-0078-1
Citation:
Peter Feldman, Sharad Kapur, David E. Long, "Efficient Techniques for Modeling Chip-Level Interconnect, Substrate and Package Parasitics," date, pp.418, Design, Automation and Test in Europe (DATE '99), 1999