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13th Asian Test Symposium (ATS'04)
Fail Pattern Identification for Memory Built-In Self-Repair
Kenting, Taiwan
November 15-November 17
ISBN: 0-7695-2235-1
Rei-Fu Huang, National Tsing Hua University
Chin-Lung Su, National Tsing Hua University
Cheng-Wen Wu, National Tsing Hua University
Shen-Tien Lin, Industrial Technology Research Institute
Kun-Lun Luo, Industrial Technology Research Institute
Yeong-Jar Chang, Industrial Technology Research Institute
With the advent of deep submicron technology and System-on-Chip (SOC) design methodology, we are seeing on-chip memory cores to represent a growing percentage of the chip area. The yield of an SOC is usually dominated by the memory yield, so the improvement of memory yield is crucial in SOC development. In this work, we propose a built-in self-repair (BISR) scheme for memory yield improving. The novelty of our approach is that we can identify the fail patterns so that appropriate spare elements (e.g., spare rows, columns, words, or blocks) can be allocated to repair the defective memory. Some BISR methods are discussed and compared. We select the scheme that uses fewer spare elements than others given the same repair rate. The area overhead of the BISR scheme is only 2.2% for an 8K × 64 memory.
Citation:
Rei-Fu Huang, Chin-Lung Su, Cheng-Wen Wu, Shen-Tien Lin, Kun-Lun Luo, Yeong-Jar Chang, "Fail Pattern Identification for Memory Built-In Self-Repair," ats, pp.366-371, 13th Asian Test Symposium (ATS'04), 2004
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