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Sixth Asian Test Symposium (ATS'97)
Analysis of the Feasibility of Dynamic Thermal Testing in Digital Circuits
Akita, JAPAN
November 17-November 18
ISBN: 0-8186-8209-4
ASCII Text
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Josep Altet, Antonio Rubio, Hideo Tamamoto, "Analysis of the Feasibility of Dynamic Thermal Testing in Digital Circuits," Asian Test Symposium, pp. 149, Sixth Asian Test Symposium (ATS'97), 1997.
 
 
BibTex
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@article{ 10.1109/ATS.1997.643951,
author = {Josep Altet and Antonio Rubio and Hideo Tamamoto},
title = {Analysis of the Feasibility of Dynamic Thermal Testing in Digital Circuits},
journal ={Asian Test Symposium},
volume = {0},
year = {1997},
issn = {1081-7735},
pages = {149},
doi = {http://doi.ieeecomputersociety.org/10.1109/ATS.1997.643951},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - CONF
JO - Asian Test Symposium
TI - Analysis of the Feasibility of Dynamic Thermal Testing in Digital Circuits
SN - 1081-7735
SP
EP
A1 - Josep Altet,
A1 - Antonio Rubio,
A1 - Hideo Tamamoto,
PY - 1997
KW - Thermal Testing. Thermal Sensors. Test Pattern Generation
VL - 0
JA - Asian Test Symposium
ER -
 
Josep Altet, Universitat Politecnica de Catalunya
Antonio Rubio, Universitat Politecnica de Catalunya
Hideo Tamamoto, Akita University
Temperature can be used as a test observable: some failures when activated produce an increase in local power dissipation, changing the surface thermal map of the IC, being detectable with built-in thermal sensors. In this work, both the feasibility of this testing technique and the generation of the specific test pattern are discussed.
Index Terms:
Thermal Testing. Thermal Sensors. Test Pattern Generation
Citation:
Josep Altet, Antonio Rubio, Hideo Tamamoto, "Analysis of the Feasibility of Dynamic Thermal Testing in Digital Circuits," ats, pp.149, Sixth Asian Test Symposium (ATS'97), 1997
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