D.K.C. Chan, K.R.P.H. Leung, C.Y. Yan, K.C.C. Chan, "Liaison: A Workflow Model for Novel Applications," Asia-Pacific Software Engineering Conference, pp. 144, Fifth Asia-Pacific Software Engineering Conference (APSEC'98), 1998.

@article{ 10.1109/APSEC.1998.733614,
author = {D.K.C. Chan and K.R.P.H. Leung and C.Y. Yan and K.C.C. Chan},
title = {Liaison: A Workflow Model for Novel Applications},
journal ={Asia-Pacific Software Engineering Conference},
volume = {0},
year = {1998},
isbn = {0-8186-9183-2},
pages = {144},
doi = {http://doi.ieeecomputersociety.org/10.1109/APSEC.1998.733614},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}

TY - CONF
JO - Asia-Pacific Software Engineering Conference
TI - Liaison: A Workflow Model for Novel Applications
SN - 0-8186-9183-2
SP
EP
A1 - D.K.C. Chan,
A1 - K.R.P.H. Leung,
A1 - C.Y. Yan,
A1 - K.C.C. Chan,
PY - 1998
VL - 0
JA - Asia-Pacific Software Engineering Conference
ER -