Trends and Challenges in VLSI Circuit Reliability

Micro
2003
Issue No. 4 - July/August
Abstract - Trends and Challenges in VLSI Circuit Reliability

	This Article
	Subscribers, please Login Purchase article: $19 PDF HTML IEEE Xplore Subscribers RSS feed
	Share
	Email this Article to a friend
	Bibliographic References
	ASCII Text BibTex RefWorks Procite/RefMan
	Add to:
	Digg Furl Spurl Blink Simpy Google Del.icio.us Y!MyWeb
	Search
	Similar Articles Articles by Cristian Constantinescu

July/August 2003 (vol. 23 no. 4)

pp. 14-19

	ASCII Text	x
	Cristian Constantinescu, "Trends and Challenges in VLSI Circuit Reliability," IEEE Micro, vol. 23, no. 4, pp. 14-19, July/August, 2003.

	BibTex	x
	@article{ 10.1109/MM.2003.1225959, author = {Cristian Constantinescu}, title = {Trends and Challenges in VLSI Circuit Reliability}, journal ={IEEE Micro}, volume = {23}, number = {4}, issn = {0272-1732}, year = {2003}, pages = {14-19}, doi = {http://doi.ieeecomputersociety.org/10.1109/MM.2003.1225959}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Micro TI - Trends and Challenges in VLSI Circuit Reliability IS - 4 SN - 0272-1732 SP14 EP19 EPD - 14-19 A1 - Cristian Constantinescu, PY - 2003 VL - 23 JA - IEEE Micro ER -

Cristian Constantinescu, Intel

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MM.2003.1225959

Deep-submicron technology is having a significant impact on permanent, intermittent, and transient classes of faults. This article discusses the main trends and challenges in circuit reliability, and explains evolving techniques for dealing with them.

Citation:

Cristian Constantinescu, "Trends and Challenges in VLSI Circuit Reliability," IEEE Micro, vol. 23, no. 4, pp. 14-19, July/Aug. 2003, doi:10.1109/MM.2003.1225959

Peer Review Notice | Give Us Feedback

Usage of this product signifies your acceptance of the Terms of Use.