Embedded Deterministic Test for Low-Cost Manufacturing

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September/October 2003 (vol. 20 no. 5)

pp. 58-66

	ASCII Text	x
	Janusz Rajski, Mark Kassab, Nilanjan Mukherjee, Nagesh Tamarapalli, Jerzy Tyszer, Jun Qian, "Embedded Deterministic Test for Low-Cost Manufacturing," IEEE Design and Test of Computers, vol. 20, no. 5, pp. 58-66, September/October, 2003.

	BibTex	x
	@article{ 10.1109/MDT.2003.1232257, author = {Janusz Rajski and Mark Kassab and Nilanjan Mukherjee and Nagesh Tamarapalli and Jerzy Tyszer and Jun Qian}, title = {Embedded Deterministic Test for Low-Cost Manufacturing}, journal ={IEEE Design and Test of Computers}, volume = {20}, number = {5}, issn = {0740-7475}, year = {2003}, pages = {58-66}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2003.1232257}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Design and Test of Computers TI - Embedded Deterministic Test for Low-Cost Manufacturing IS - 5 SN - 0740-7475 SP58 EP66 EPD - 58-66 A1 - Janusz Rajski, A1 - Mark Kassab, A1 - Nilanjan Mukherjee, A1 - Nagesh Tamarapalli, A1 - Jerzy Tyszer, A1 - Jun Qian, PY - 2003 VL - 20 JA - IEEE Design and Test of Computers ER -

Janusz Rajski, Mentor Graphics

Mark Kassab, Mentor Graphics

Nilanjan Mukherjee, Mentor Graphics

Nagesh Tamarapalli, Mentor Graphics

Jerzy Tyszer, Poznan University of Technology

Jun Qian, Cisco Systems

DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2003.1232257

Editor's note:

You have probably heard that BIST takes too long and its fault coverage is low, and that deterministic test requires too many patterns. This article shows how on-chip compression and decompression techniques can provide high fault coverage with low test times.

—Rob Aitken, Artisan Components

Citation:

Janusz Rajski, Mark Kassab, Nilanjan Mukherjee, Nagesh Tamarapalli, Jerzy Tyszer, Jun Qian, "Embedded Deterministic Test for Low-Cost Manufacturing," IEEE Design and Test of Computers, vol. 20, no. 5, pp. 58-66, Sep./Oct. 2003, doi:10.1109/MDT.2003.1232257

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